MF-SM013/250V-2 Bourns Inc., MF-SM013/250V-2 Datasheet - Page 2

• Manufacturer Part Number: MF-SM013/250V-2
• Description: FUSE RESETTABLE
• Manufacturer: Bourns Inc.
• Series: MF-SMr
• Type: Telecom PTC Resettable Fusesr

Specifications of MF-SM013/250V-2

• Package / Case: Non-Standard SMD
• Voltage - Max: 250V
• Current - Max: 3A
• Current - Hold (ih) (max): 130mA
• R Min/max: 6.500 ~ 12.00 Ohm
• Hold Current: 0.13 Amp
• Trip Current: 0.26 Amp
• Current Rating (max): 3 Amps
• Resistance: 12 Ohms
• Maximum Voltage: 60 VoltsDC
• Termination Style: SMD/SMT
• Mounting Style: SMD/SMT
• Current Rating: 3 Amps
• Dimensions: 6.6 mm L x 3.2 mm W x 7.4 mm H
• Lead Spacing: 1.53 mm
• Operating Temperature Range: - 40 C to + 85 C
• Holding Current: 130mA
• Initial Resistance Max: 12ohm
• Operating Voltage: 60V
• Ptc Fuse Case: SMD
• External Depth: 7.4mm
• External Width: 6.6mm
• Initial Resistance Min: 6.5ohm
• Length/height, External: 3.2mm
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Trip (it): -
• Time To Trip: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

The recommended long term storage conditions for Multifuse
remain in the original sealed packaging prior to use. Devices may not conform with data sheet specifications if these storage recommendations are
exceeded. Devices stored in this manner have an indefinite shelf life.
Packaging:
TAPE & REEL: 1000 pcs. per reel
Solder Reflow Recommendations
Product Dimensions
Storage Recommendations
300
250
200
150
100
50
0
MF-SM013/250V Series -
(.260)
6.6
(.076)
1.94
MAX.
Preheating
160–220
Time (seconds)
(.126)
MAX.
(.291)
3.2
MAX.
7.4
Terminal material:
Tin-plated brass
Soldering
10–20
Telecom PTC Resettable Fuses
Cooling
®
120
Polymer PTC devices are 40 °C maximum and 70 % RH maximum. All devices should
Recommended Pad Layout
Solder reflow
• Recommended reflow methods: IR, vapor phase oven, hot air oven.
• Devices are not designed to be wave soldered to the bottom side of the
• Gluing the devices is not recommended.
• Recommended maximum paste thickness is 0.25 mm (.010 inch).
• Devices can be cleaned using standard industry methods and solvents.
Note:
• If reflow temperatures exceed the recommended profile, devices may not
Rework
• A device should not be reworked.
meet the performance requirements.
board.
(.090)
2.29
Customers should verify actual device performance in their specific applications.
(.095)
2.41
(.250)
6.35
(.095)
2.41
(.090)
2.29
Specifications are subject to change without notice.
(.135)
3.43
DIMENSIONS =
(INCHES)
MM