GCM1885G1H681JA16D Murata Electronics North America, GCM1885G1H681JA16D Datasheet - Page 46
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GCM1885G1H681JA16D
Manufacturer Part Number
GCM1885G1H681JA16D
Description
CAP CER 680PF 50V X8G SMD
Manufacturer
Murata Electronics North America
Series
GCMr
Datasheet
1.GCM0335C1ER30CD03D.pdf
(66 pages)
Specifications of GCM1885G1H681JA16D
Voltage - Rated
50V
Lead Style
*
Capacitance
680pF
Tolerance
±5%
Temperature Coefficient
X8G
Mounting Type
*
Operating Temperature
-55°C ~ 150°C
Applications
Automotive
Ratings
AEC-Q200
Package / Case
*
Size / Dimension
*
Thickness
*
Lead Spacing
*
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
2
!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
44
No.
20 Beam Load Test
21
Medium Voltage for Automotive GCM Series Low Disspation Factor Specifications and Test Methods
Specifications and Test Methods
Continued from the preceding page.
Capacitance
Temperature
Character-
istics
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
AEC-Q200
Test Item
Capacitance
Change
Capacitance
Drift
The chip endure following force.
-750 120 ppm/ C
(Temp. Range: +25 to +125 C)
-750 120, -347 ppm/ C
(Temp. Range: -55 to +25 C)
Within 0.5% or 0.05 pF
(Whichever is larger)
< Chip L dimension: 2.5mm max. >
< Chip L dimension: 3.2mm min. >
Chip thickness G 0.5mm rank: 20N
Chip thickness V 0.5mm rank: 8N
Chip thickness F 1.25mm rank: 15N
Chip thickness U 1.25mm rank: 54.5N
Specifications
Place the capacitor in the beam load fixture as Fig. 4.
Apply a force.
< Chip L dimension: 2.5mm max. >
< Chip L dimension: 3.2mm min. >
Speed supplied the Stress Load: 2.5mm / s
The capacitance change should be measured after 5 minutes
at each specified temperature stage.
The temperature coefficient is determined using the capacitance
measured in step 3 as a reference. When cycling the
temperature sequentially from step1 through 5 the capacitance
should be within the specified tolerance for the temperature
coefficient. The capacitance drift is calculated by dividing the
differences between the maximum and minimum measured
values in steps 1, 3 and 5 by the capacitance value in step 3.
Step
1
2
3
4
5
AEC-Q200 Test Method
L
0.6 L
Temperature ( C)
Fig. 4
125 3
-55 3
25 2
25 2
25 2
Iron Board
C03E.pdf
10.5.20