ENW-89811K4CF Panasonic, ENW-89811K4CF Datasheet - Page 38

• Manufacturer Part Number: ENW-89811K4CF
• Description: Bluetooth / 802.15.1 Modules & Development Tools
• Manufacturer: Panasonic

Specifications of ENW-89811K4CF

• Wireless Frequency: 2.4 GHz
• Interface Type: I2C, JTAG, UART
• Data Rate: 3 Mbps
• Modulation: DQPSK
• Operating Voltage: 2.7 V to 3.6 V
• Operating Temperature Range: - 40 C to + 85 C
• Output Power: 2.5 dBm
• Technology/ Type: PAN1321 Bluetooth Module with Antenna
• Processor Series: PAN1321
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

9.5
Generally all standard reflow soldering processes (vapour phase, convection, infrared) and typical temperature
profiles used for surface mount devices are suitable for the PAN1321 module. Wave soldering is not possible.
Figure 14
solder.
Figure 14
Figure 15
Hardware Description
User’s Manual
Recommended temp. profile
for reflow soldering (J-STD-020C)
260°C
255°C
217°C
200°C
150°C
25°C
Temp.[°C]
and
Soldering Profile
Eutectic Lead-Solder Profile
Eutectic Leadfree-Solder Profile
Recommended temp. profile
for reflow soldering
Temp
Figure 15
.[°C]
150 ±10°C
shows example of a suitable solder reflow profile. One for leaded and one for leadfree
60 ~ 120
8 minutes max
235°C max.
220 ±5°C
sec @ 3’C/sec max
200°C
38
90 ±30s
60 ~ 150
30 sec
max
30 +20/-10s
sec
Lead _S older _P rof ile .v s d
10 ±1s
LeadF ree _S older _P rof ile . v s d
Revision 3.1, 2011-01-18
Time [s]
Assembly Guidelines
6’C/sec
ENW89811K4CF
max
PAN1321-SPP
Time [s]