24-7068-6417 Kester, 24-7068-6417 Datasheet - Page 7

• Manufacturer Part Number: 24-7068-6417
• Description: Solder, Fluxes & Accessories WATER SOLUBLE FLUX 1LB .025 DIAMETER
• Manufacturer: Kester

Specifications of 24-7068-6417

• Alloy: Sn96.5Ag3Cu0.5
• Diameter: 0.025 in
• Weight: 1 lb
• Core Size: 66
• Product: Fluxes & Pastes
• Description/function: Water Soluble Flux
• Outer Diameter: 0.025"
• Solder Gauge Awg: 23AWG
• Solder Alloy: 96.5/3/0.5 Sn/Ag/Cu
• Melting Temperature: 217°C
• External Diameter: 0.025"
• Flux Core Size No.: 66
• Lead Free: Yes
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Packaging Style
Packaging Style
Characteristics
Characteristics
Formula Type
Formula Type
Specifications
Specifications
Compliant
Mesh Size
Suggested
Compliant
Mesh Size
Suggested
Removal
Removal
Residue
Metal %
Residue
Metal %
Pro duct
Powder
Product
Powder
Alloy
Alloy
engineered to provide excellent solderability
to lead free component and board finishes.
process parameters and 0201 application
Sn63Pb37
Provides optimal performance in all types of dispensing applications. R276 is pack-
Exhibits excellent dispensing characteristics with a wide range of needle diameters.
aged void-free to ensure consistent dispensing in high speed automated processes.
High activity no-clean paste specifically
capable. Wide reflow process window.
Consistent print volume regardless of
Compatible with enclosed print head
Telcordia Issue 1GR-78-CORE,
600g, 1400g cartridges
Easy Profile 256HA
Not normally required.
-325/+500 (Type 3)
Classification ROL0
IPC/J-STD-004
500g jar,
systems.
90%
*For lead based products, Kester produces solder powder to J-STD-006B for alloy purity and
Sn62Pb36Ag2
IPC/J-STD-004 Classification ROL0
particle distribution, except for Antimony, which is specified to a maximum of 0.2%.
Telcordia Issue 1GR-78-CORE,
35g and 100g syringes
Not normally required.
-325/+500 (Type 3)
No-Clean
Sn63Pb37
Solder Paste
R276
87%
Sn63Pb37
applications. Compatible with enclosed
variety of reflow profiles and printing
conditions. Industry standard formula
Standard no-clean paste for a wide
that performs well in a variety of
Telcordia Issue 1GR-78-CORE,
600g, 1400g cartridges
Not normally required.
Easy Profile
-325/+500 (Type 3)
print head systems.
Classification ROL0
IPC/J-STD-004
500g jar,
90%
Sn62Pb36Ag2
®
256
Solder Paste for Syringe Dispensing Applications
Solder Paste for Stencil Printing Applications
metallizations, including palladium. Compatible with
consistently so that every batch results in high yield
very active formula is effective on a wide variety of
extremely robust printing, even with idle time up
to 1 hour and print speeds of up to 6 in/sec. This
Sn63Pb37
This highly-active, anti-slump paste is produced
manufacturing. HydroMark 531 also offers
The activator package in this formula is aggressive enough to remove tenacious oxide layers or
Use de-ionized or soft tap water at
enclosed print head systems.
600g, 1400g cartridges
-325/+500 (Type 3)
solder to OSP coated boards. R500 delivers excellent wetting characteristics.
Classification ORM0
HydroMark 531
IPC/J-STD-004
120-140°F.
500g jar,
90%
Sn62Pb36Ag2
Use de-ionized or soft tap water at
35g and 100g syringes
Water-Soluble
-325/+500 (Type 3)
Classification ORH0
IPC/J-STD-004
120-140°F.
Sn63Pb37
R500
86%
and minimal void production, R562 has a stencil life
Sn63Pb37
Designed for maximum environmental robustness
of over 8 hours and may be used in a wide range
of humidities (10 - 85% RH). Compatible with
Use de-ionized or soft tap water at
enclosed print head systems.
600g, 1400g cartridges
-325/+500 (Type 3)
Classification ORH0
IPC/J-STD-004
120-140°F.
500g jar,
R562
90%
Sn62Pb36Ag2