BB830T BusBoard Prototype Systems, BB830T Datasheet
BB830T
Specifications of BB830T
BB830T Summary of contents
Page 1
... IC/Circuit Area, 630 tie-points 2 Distribution strips, 200 tie-points Size: 6.5 x 2.2 x 0.3in (165.1 x 54.6 x 8.5mm) BB830T – Transparent 830 tie-point plug-in Solderless BreadBoard Transparent ABS plastic with color legend 1 IC/Circuit Area, 630 tie-points 2 Distribution strips, 200 tie-points Size: 6.5 x 2.2 x 0.3in (165.1 x 54.6 x 8.5mm) BusBoard Prototype Systems www ...
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... All BPS BreadBoards are Lead-Free and RoHS Compliant. Internal Connections The BB830 and BB830T breadboards have 63 vertical columns on top and 63 columns below. Each column has 5 connected holes each (the green lines). This is the circuit area. The are also 4 “rails” (or distribution strips) for power and ground running horizontally (the red and blue lines). ...
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... These alloys are notable for their toughness, strength, low coefficient of friction, and fine grain. The phosphorus also improves the fluidity of the molten metal and thereby improves the castability, and improves mechanical properties by cleaning up the grain boundaries. Source http://en.wikipedia.org/wiki/Phosphor_bronze BusBoard Prototype Systems www.BusBoard.net sales@busboard.net - Built for designers BPS-MAR-BB830+BB830T-001 Rev 3.05 ...