BB300 BusBoard Prototype Systems, BB300 Datasheet
BB300
Specifications of BB300
BB300 Summary of contents
Page 1
... Completed projects can be moved to the SB300 and SB400 Solderable PC BreadBoards to make them permanent. BB300 Plugin BreadBoard BB300 – 300 tie point Solderless BreadBoard white ABS plastic with black legend 1 IC-Circuit Area, 300 tie-points Size: 3.3 x 1.4 x 0.3in (84 x 35.5 x 8.5mm) ...
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... Metal Back Plate Thickness: 0.031 inches (0.8mm) All BPS BreadBoards are Lead-Free and RoHS Compliant. Internal Connections BB300 BreadBoard The BB300 breadboard tie-points are connected in 60 vertical columns (the green lines) with 5 connected holes in each. This is the circuit area. When an integrated circuit is plugged into the breadboard, each I ...
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... These alloys are notable for their toughness, strength, low coefficient of friction, and fine grain. The phosphorus also improves the fluidity of the molten metal and thereby improves the castability, and improves mechanical properties by cleaning up the grain boundaries. Source http://en.wikipedia.org/wiki/Phosphor_bronze BusBoard Prototype Systems www.BusBoard.net sales@busboard.net - Built for designers BPS-MAR-BB300+BB400-001 Rev 3.10 ...