4170-500ML MG Chemicals, 4170-500ML Datasheet
4170-500ML
Manufacturer Part Number
4170-500ML
Description
Chemicals NEGATIVE DEVELOPER 16OZ LIQUID
Manufacturer
MG Chemicals
Specifications of 4170-500ML
Description/function
Negative Developer
Product
Prototyping/Board Repair
Size
500 ml
Container
Bottle
Chemical Component
Potassium Carbonate/Water
Dispensing Method
Bottle
Primary Type
Negative Developer
Special Features
Non-Flammable
Weight
17 fl.oz.
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Negative Dry Film Resist
Cat. No. 416DFR-5
Data Sheet and Processing Information
PART 1: Copper Surface and Surface Preparation
For best results, clean the board using fine steel wool or similar abrasive pad and rinse with water. The
will remove dirt, oils, and other contamination.
Wear powder –free gloves when working with Negative Dry Film Resist.
The board must be absolutely clean and dry prior to applying the film. Use M.G. Chemicals Super Wash
Electronics Cleaner to quick dry board or heat it in a an over for 5 minutes or use a blow dryer.
Note: After rinse, the board should be dried quickly to avoid oxidation.
PART 2: Lamination
Work in a safe light environment when handling the film – any exposure to UV light will expose the film.
Safe light refers to any incandescent bulb less than 40 watts.
Any Automatic Sheet laminator from an office supply store will work fine.
Typical conditions:
PART 3: Exposure
M.G. Chemicals Negative Dry Film Resist can be exposed on all standard equipment used in the printed
circuit industry. Choose a day light rated UV light that compliment the peak resist response of 350 – 380
nm.
We suggest the use of M.G. Chemicals Exposure Kit (Cat. No.416-X). Expose artwork onto the
presensitized copper clad board for 12 minutes.
Resolution down to 50 microns (2 mil) is possible.
PART 4: Development
Can be developed using Potassium Carbonate with good productivity.
• Pre heat laminator until ‘ready’ indicator is lit
• Seal bar temperature: 50 – 80 ◦C (120 – 176◦C)
• Laminator roll temperature: 100 – 115 ◦C (212 – 239◦F)
• Speed m/min(ft/min): 2.0 +/- 1.0 (6.5 +/- 3.3)
• Pressure kg/cm
2
(psi): 2.5 +/- 1.5 (40 +/- 20)
4170-500ML Summary of contents
Page 1
... Wear powder –free gloves when working with Negative Dry Film Resist. The board must be absolutely clean and dry prior to applying the film. Use M.G. Chemicals Super Wash Electronics Cleaner to quick dry board or heat over for 5 minutes or use a blow dryer. ...
Page 2
... It is highly recommended to use M.G. Chemicals Negative Developer (Cat. No. 4170-500ML has been formulated specifically for the Negative Dry Film Resist. Peel the second protective covering from the board before submerging into solution. Brush board lightly with foam brush (Cat. No. 416-S) in developer solution. Process should only take 1 – 2 minutes. Visual inspection required to determine completion ...