HW004A0A1-SZ Lineage Power, HW004A0A1-SZ Datasheet - Page 26

• Manufacturer Part Number: HW004A0A1-SZ
• Description: DC/DC Converters & Regulators 48Vin 5Vout 4A SMT
• Manufacturer: Lineage Power
• Series: HW004r

Specifications of HW004A0A1-SZ

• Output Power: 20 W
• Input Voltage Range: 36 V to 75 V
• Number Of Outputs: 1
• Output Voltage (channel 1): 5 V
• Output Current (channel 1): 4 A
• Isolation Voltage: 1.5 KV
• Package / Case Size: SMD
• Output Type: Isolated
• Output Voltage: 5 V
• Package / Case: SMD
• Product: Isolated
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 109100237

Data Sheet
October 5, 2009
Surface Mount Information
Figure 73. Time Limit Curve Above 205
Lead Free Soldering
The –Z version SMT modules of the HW/HC series
are lead-free (Pb-free) and RoHS compliant and are
compatible in a Pb-free soldering process. Failure to
observe the instructions below may result in the
failure of or cause damage to the modules and can
adversely affect long-term reliability.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices) for
both Pb-free solder profiles and MSL classification
procedures. This standard provides a recommended
forced-air-convection reflow profile based on the
volume and thickness of the package (table 4-2). The
suggested Pb-free solder paste is Sn/Ag/Cu (SAC).
The recommended linear reflow profile using
Sn/Ag/Cu solder is shown in Figure. 74.
MSL Rating
The HW/HC series SMT modules have a MSL rating
of 1.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount
packages is detailed in J-STD-033 Rev. A (Handling,
Packing, Shipping and Use of Moisture/Reflow
Sensitive Surface Mount Devices). Moisture barrier
bags (MBB) with desiccant are required for MSL
ratings of 2 or greater. These sealed packages
should not be broken until time of use. Once the
original package is broken, the floor life of the product
at conditions of ≤ 30°C and 60% relative humidity
varies according to the MSL rating (see J-STD-033A).
LINEAGE
240
235
230
225
220
205
200
215
210
0
POWER
10
20
TIME LIMIT (S)
18-36Vdc & 36-75Vdc Input; 1.0V-5Vdc Output; 4A - 6A Output Current
30
40
(continued)
o
C Reflow .
50
60
HW/HC004/005/006 Series DC-DC Power Module:
The shelf life for dry packed SMT packages will be a
minimum of 12 months from the bag seal date, when
stored at the following conditions: < 40° C, < 90%
relative humidity.
Post Solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the
testability of the finished circuit-board assembly. For
guidance on appropriate soldering, cleaning and
drying procedures, refer to Lineage Power Board
Mounted Power Modules: Soldering and Cleaning
Application Note (AP01-056EPS).
Figure 74. Recommended linear reflow profile
using Sn/Ag/Cu solder.
Solder Ball and Cleanliness Requirements
The open frame (no case or potting) power module
will meet the solder ball requirements per
J-STD-001B. These requirements state that solder
balls must neither be loose nor violate the power
module minimum electrical spacing.
The cleanliness designator of the open frame power
module is C00 (per J specification).
300
250
200
150
100
50
0
Per J-STD-020 Rev. C
Heating Zone
1°C/Second
Peak Temp 260°C
Reflow Time (Seconds)
* Min. Time Above 235°C
*Time Above 217°C
15 Seconds
60 Seconds
Cooling
Zone
26