TGF150D FerriShield, TGF150D Datasheet

TGF150D

Manufacturer Part Number

TGF150D

Description

Thermal Interface Products Thermal Gap Fill Pad

Manufacturer

FerriShield

Type

Thermal Gap Filler Padsr

Datasheet

1.TGF600M.pdf (1 pages)

Specifications of TGF150D

Color

Light Gray

Length

300 mm

Thickness

1 mm

Width

200 mm

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Current page: 1 of 1
Download datasheet (2Mb)

Mulberry Professional Plaza • 426 Mulberry Street * Suite 300 • Scranton, PA 18503

Tel: 570.961.5617 • Fax: 570.969.6274 • e-mail: info@ferrishield.com

thermal gap filler pads

material characteristics

thermal properties

Visitors to this web site are authorized to download this information

Part Number

Description

Color

Thermal Conductivity

Volume Resistivity

Withstand Voltage

Specific Gravity

Hardness

Elongation

Compression

Sheet Size

for reprints or electronic transfer to their technical reference files.

Thermal Gap Filler Pads are high heat transfer media which conform to

surface irregularities and adhere to a wide range of shapes and sizes of

components; in particular, recessed areas and protrusions.

Where space between mating surfaces varies or is uneven, and where

surface textures are normally a thermal transfer concern, the very pliable

conformity of the pads is excellent for filling air gaps and minute

variations.

A widely recognized axiom of chemical engineering and stress analysis

states that, for every 10˚C change in temperature, the reaction is a factor

of 2; i.e., mean-time-to-failure of a device can be reduced by a factor of 2

for every 10˚C temperature rise.

Four grades, each with a cost-effective formulation suitable for the

thermal conductivity needed on a given application, accommodate most

demanding situations. Convenient sheet configurations are suitable for

die-cutting, or easy hand-slitting operations.

As shown in the drawings to the right, even the most highly polished

mating surfaces do not make reliable contact surfaces. Complete physical

contact is necessary to minimize the resistance to heat flow for the best

thermally conductive path. All such surface voids, when properly filled with

a conformable, thermally conductive gap filler pad, will in most cases

exhibit close to the continuous characteristics of a solid metal of the same

dimensions.

TGF600M

Material Characteristic

TGF150D

Material

Extractable Volatiles

Continuous Use Temperature

Flammability

Thermal Conductivity

TGF120K

TGF280L

For further technical information, please contact us at:

1.0

1.2

w w w . f e r r i s h i e l d . c o m

PDF Technical File

1.5

@ 50% sustain

2.0

KgF @ 10%

KV/mm•AC

L x W x T

Shore 00

W/m-K

MΩ•m

gr/cm

visual

Thermal Conductivity W/m-K

Unit

ISO 9001:2000 registered

2.8

3.0

Measure

silicone compound

content % cyclodimethyl siloxane

@ D4 - D10 < 0.0010 wt %

-60˚ to 200˚C

UL94 V-0 (file # E58126)

up to 6.00 W/m-K; 4 formulas

TGF120K

4.2 x 10

4.0

black

1.20

13.0

40.0

250

2.3

11.75 x 7.875 x .039

5.0

6.0

TGF150D

light gray

1.0 x 10

6.0

1.50

12.5

39.2

100

2.6

Part Number

Thermal impedance of semiconductor mounted to

substrate is appreciably increased at junction of porous

surfaces due to a lack of surface-to-surface contact.

Thermal impedance of semiconductor mounted to

substrate with gap filler pad is eliminated yielding higher

temperature gradient.

High

Low

TGF280L

dark gray

2.5 x 10

2.80

11.0

44.0

Thermal Impedance versus Surface Contact

2.7

300 x 200 x 1.0 mm

Thermal

Break

Thermal

Break

TGF600M

1.3 x 10

brown

10.7

50.6

6.0

3.2

Less

Related parts for TGF150D

Related keywords

TGF150D datasheet
TGF150D data sheet
TGF150D pdf datasheet
TGF150D component
TGF150D part
TGF150D distributor
TGF150D RoHS
TGF150D datasheet download