BLM21BD601SN1D Murata, BLM21BD601SN1D Datasheet - Page 6

• Manufacturer Part Number: BLM21BD601SN1D
• Description: EMI/RFI Suppressors & Ferrites 0805 600 OHM
• Manufacturer: Murata
• Series: BLM Br

Specifications of BLM21BD601SN1D

• Shielding: Unshielded
• Test Frequency: 100 MHz
• Product: Chip Ferrite Beads
• Impedance: 600 Ohms
• Tolerance: 25 %
• Maximum Dc Current: 200 mAmps
• Maximum Dc Resistance: 0.35 Ohms
• Operating Temperature Range: - 55 C to + 125 C
• Package / Case: 0805 (2012 metric)
• Termination Style: SMD/SMT
• Dc Resistance Max: 0.35ohm
• Dc Current Rating: 200mA
• Ferrite Mounting: SMD
• Ferrite Case Style: 0805
• Inductor Case Style: 0805
• No. Of Pins: 2
• Core Material: Ferrite
• Rohs Compliant: Yes
• Operating Temperature Min: -55°C
• Resistance: 0.35ohm
• Operating Temperature Max: +125°C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

I Impedance-Frequency Characteristics
I !Caution/Notice
! Note:
1. This datasheet is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our
2. This datasheet has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product
o
!Caution (Rating)
products in it may be discontinued without advance notice. Please check with our sales representatives or product engineers before ordering.
specifications or transact the approval sheet for product specifications before ordering.
Continued from the preceding page.
This data sheet is applied for CHIP FERRITE BEAD used for General Electronics equipment for your design.
Do not use products beyond the rated current and
rated voltage as this may create excessive heat
and deteriorate the insulation resistance.
3500
3000
2500
2000
1500
1000
500
0
1
BLM21BD272SN1
10
Frequency (MHz)
Z
R
100
X
Noise Suppression Products/EMI Suppression Filters > Chip EMIFILr Inductor Type > Chip Ferrite Beads
1000 2000
http://www.murata.com/
Data Sheet
Notice
Solderability of Tin plating termination chip might be
deteriorated when low temperature soldering profile
where peak solder temperature is below the Tin melting
point is used. Please confirm the solderability of Tin
plating termination chip before use.
2006.7.7
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