BLM21BB221SH1D Murata, BLM21BB221SH1D Datasheet - Page 71

• Manufacturer Part Number: BLM21BB221SH1D
• Description: EMI/RFI Suppressors & Ferrites 0805 220ohms HiSpeed Signal Line Tape
• Manufacturer: Murata
• Series: BLM Br

Specifications of BLM21BB221SH1D

• Shielding: Unshielded
• Test Frequency: 100 MHz
• Product: Chip Ferrite Beads
• Impedance: 220 Ohms
• Tolerance: 25 %
• Maximum Dc Current: 200 mAmps
• Maximum Dc Resistance: 0.35 Ohms
• Operating Temperature Range: - 55 C to + 125 C
• Package / Case: 0805 (2012 metric)
• Termination Style: SMD/SMT
• Dc Resistance Max: 0.35ohm
• Dc Current Rating: 200mA
• Ferrite Mounting: SMD
• Ferrite Case Style: 0805 / 2012
• Operating Temperature Max: +125°C
• Operating Temperature Min: -55°C
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
NFM21H
NFE61H
DLW31S
DLW43S
Continued from the preceding page.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Series
oUse Sn/Pb=60/40 or Sn-3.0Ag-0.5Cu solder for
oCoat the solder paste a thickness: 100-150 m
oUse Sn/Pb=60/40 or Sn-3.0Ag-0.5Cu solder for
oCoat the solder paste a thickness: 150-200 m
oUse Sn/Pb=60/40 or Sn-3.0Ag-0.5Cu solder for
oCoat the solder paste a thickness: 100-150 m
*Solderability is subject to reflow condition and thermal
oUse Sn/Pb=60/40 or Sn-3.0Ag-0.5Cu solder for
oCoat the solder paste a thickness: 150 m
*Solderability is subject to reflow condition and thermal
conductivity. Please make sure that your product has
been evaluated in view of your specifications with our
product being mounted to your product.
conductivity. Please make sure that your product has
been evaluated in view of your specifications with our
product being mounted to your product.
pattern printing. Use of Sn-Zn based solder will
deteriorate performance of products. If using
Sn-Zn based solder, please contact Murata in
advance.
pattern printing.
pattern printing.
pattern printing.
a
b
a
b
Solder Paste Printing
1.4
0.6
2.6
1.5
4.8
8.8
DLW43S
Series
DLW31S
Series
3.0 (510)
3.2 (101)
a
1.6
a
Chip EMIFILr (Soldering and Mounting)
3.7
5.9
b
b
0.4
1.6
c
c
1.6
3.4
d
d
Apply 1.0mg of bonding agent at each chip.
*Except NFE61HT332
Bonding agent
Adhesive Application
Continued on the following page.
Bonding agent
1.5
4.8
9.0
(in mm)
C50E.pdf
69
08.8.28
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