BLM18KG601SN1D Murata, BLM18KG601SN1D Datasheet - Page 183

• Manufacturer Part Number: BLM18KG601SN1D
• Description: EMI/RFI Suppressors & Ferrites 0603 600ohms 1.3A
• Manufacturer: Murata

Specifications of BLM18KG601SN1D

• Product: Chip Ferrite Beads
• Impedance: 600 Ohms
• Maximum Dc Current: 1300 mAmps
• Maximum Dc Resistance: 0.15 Ohms
• Operating Temperature Range: - 55 C to + 125 C
• Package / Case: 0603 (1608 metric)
• Termination Style: SMD/SMT
• Dc Resistance Max: 0.15ohm
• Dc Current Rating: 1.3A
• Ferrite Mounting: SMD
• Ferrite Case Style: 0603 / 1608
• External Width: 1.6mm
• Operating Temperature Max: 125°C
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

PLp Chip Common Mode Choke Coil
(1) Soldering Methods
(2) Soldering Profile
(3) Reworking with Solder Iron
Do not clean after soldering. If cleaning, please contact us.
!Note
3. Standard Soldering Conditions
4. Cleaning
oReflow Soldering Profile
Use reflow soldering methods only.
Use standard soldering conditions when soldering
common mode choke
In cases where several different parts are soldered, each
having different soldering conditions, use those
conditions requiring the least heat and minimum time.
The following conditions must be strictly followed when
using a soldering iron.
Pre-heating: 150 C 60s min.
Soldering iron power output / Tip diameter:
Temperature of soldering iron tip / Soldering time / Times:
(Sn-3.0Ag-0.5Cu Solder)
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.
80W max. / ø3mm max.
400 C max. / 5s / 2 times
PLT10H
Series
coils.
220 C min.
Temp. (T1)
Soldering and Mounting
180
150
Heating
30 to 60s
Time. (t1)
Standard Profile
Pre-heating
chip
90s 30s
Temperature
T2
T1
250 3 C
Peak
(T2)
t1
t2
Solder: Use Sn-3.0Ag-0.5Cu solder. Use of Sn-Zn based
Flux:
o Use Rosin-based flux.
o Do not use strong acidic flux (with chlorine content
o Do not use water-soluble flux.
For additional mounting methods, please contact Murata.
of Reflow
time (s)
2 times
exceeding 0.20wt%)
For additional methods of reworking with a soldering iron,
please contact Murata engineering.
Cycle
T4
T3
use Rosin-based flux.
max.
Do not allow the tip of the soldering iron to directly
contact the chip.
Limit Profile
Standard Profile
solder will deteriorate performance of products.
230 C min.
Temp. (T3)
Heating
60s max.
Time. (t2)
Limit Profile
Temperature
260 C/10s
Peak
(T4)
of Reflow
2 times
Cycle
max.
181
Mar.28,2011
C31E.pdf