BLM18PG221SN1D Murata, BLM18PG221SN1D Datasheet - Page 179
![EMI/RFI Suppressors & Ferrites 220ohms](/photos/16/33/163388/lpmuratablm_sml.jpg)
BLM18PG221SN1D
Manufacturer Part Number
BLM18PG221SN1D
Description
EMI/RFI Suppressors & Ferrites 220ohms
Manufacturer
Murata
Specifications of BLM18PG221SN1D
Shielding
Unshielded
Test Frequency
100 MHz
Product
Chip Ferrite Beads
Impedance
220 Ohms
Tolerance
25 %
Maximum Dc Current
1400 mAmps
Maximum Dc Resistance
0.1 Ohms
Operating Temperature Range
- 55 C to + 125 C
Package / Case
0603 (1608 metric)
Termination Style
SMD/SMT
Dc Resistance Max
0.1ohm
Dc Current Rating
1.4A
Ferrite Mounting
SMD
Ferrite Case Style
0603
Inductor Case Style
0603
No. Of Pins
2
Core Material
Ferrite
Resistance
0.1ohm
Rohs Compliant
Yes
Operating Temperature Min
-55°C
Operating Temperature Max
+125°C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
BLM18PG221SN1D
Manufacturer:
MURATA
Quantity:
600 000
Company:
Part Number:
BLM18PG221SN1D
Manufacturer:
Murata Electronics North Ameri
Quantity:
93 827
Company:
Part Number:
BLM18PG221SN1D
Manufacturer:
MURATA
Quantity:
125
Part Number:
BLM18PG221SN1D
Manufacturer:
MURATA/村田
Quantity:
20 000
DLp Chip Common Mode Choke Coil
!Note
DLP
DLW
DLM
2. Solder Paste Printing and Adhesive Application
When reflow soldering the
coils, the printing must be conducted in accordance with
the following cream solder printing conditions.
If too much solder is applied, the chip will be prone to
damage by mechanical and thermal stress from the PCB
and may crack.
Standard land dimensions should be used for resist and
copper foil patterns.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.
Series
DLP0NS/11S/11T/31S/DLM11G
oGuideline of solder paste thickness:
*Solderability is subject to reflow conditions and
thermal conductivity. Please make sure that your
product has been evaluated in view of your
specifications with our product being mounted to your
product.
DLP0NS
DLP11S
DLP11T
DLP31S
DLM11G
DLP2AD/31D
100-150 m: DLW21S/21H/31S,
150-200 m: DLP31D/31S, DLM2HG,
DLW5AH/5BS/5BT
Series
c
d
a
chip common mode choke
5.5
2.9
0.9
b
0.3
0.7
0.5
1.0
0.5
a
0.55
0.55
0.3
0.6
0.5
DLP0NS/11S/11T/1ND/2AD/DLM11G
DLW5AH/5BS/5BT
a
b
Solder Paste Printing
0.3
0.3
0.3
0.7
0.4
c
Soldering and Mounting
0.55
0.55
0.5
2.1
0.7
d
DLW21S/H
DLW31S
DLP1ND
DLP2AD
DLP31D
Series
Series
DLW21S/21H/31S
DLM2HG
a
b
0.55
0.3
1.0
a
0.8
1.6
a
0.3
0.4
0.8
b
2.6
3.7
1.0
4.0
b
0.25
0.2
0.4
0.5
0.4
c
c
When flow soldering the
apply the adhesive in accordance with the following
conditions.
If too much adhesive is applied, then it may overflow into
the land or termination areas and yield poor solderability.
In contrast, if insufficient adhesive is applied, or if the
adhesive is not sufficiently hardened, then the chip may
become detached during flow soldering process.
0.4
0.5
0.8
1.2
1.6
d
d
DLP31S/DLM2HG/DLP31D
Apply 0.3mg of bonding agent at each chip.
Coating Position of
Bonding Agent
Coating Position of
Bonding Agent
DLP31D
Adhesive Application
chip common mode choke
DLM2HG
Coating Position of
Bonding Agent
DLP31S
(in mm)
coils,
177
Mar.28,2011
C31E.pdf