BLM18HG601SN1D Murata, BLM18HG601SN1D Datasheet - Page 142

• Manufacturer Part Number: BLM18HG601SN1D
• Description: EMI/RFI Suppressors & Ferrites 0603 600 OHM
• Manufacturer: Murata

Specifications of BLM18HG601SN1D

• Shielding: Unshielded
• Test Frequency: 100 MHz
• Product: Chip Ferrite Beads
• Impedance: 600 Ohms
• Tolerance: 25 %
• Maximum Dc Current: 200 mAmps
• Maximum Dc Resistance: 1 Ohms
• Operating Temperature Range: - 55 C to + 125 C
• Package / Case: 0603 (1608 metric)
• Termination Style: SMD/SMT
• Dc Resistance Max: 1ohm
• Dc Current Rating: 200mA
• Ferrite Mounting: SMD
• Ferrite Case Style: 0603
• Inductor Case Style: 0603
• No. Of Pins: 2
• Core Material: Ferrite
• Resistance: 1ohm
• Rohs Compliant: Yes
• Operating Temperature Min: -55°C
• Operating Temperature Max: +125°C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

o
!Note
140
NFA18S
NFA21S
NFA31G
NFA31C
NFW31S
NFE31P
NFE61P
PCB Warping
PCB should be designed so that products are not
subjected to the mechanical stress caused by warping
the board.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.
Reflow Soldering
R0.1 to R0.2 is preferred to obtain
high voltage withstanding
o Reflow Soldering NFA31G/31C
o Reflow Soldering
2.0
4.8
8.8
Small diameter thru hole ø0.4
0.05
0.5
0.175
0.3
0.225
NFA18S
1.375
2.35
0.4
1.3
2.0
2.6
3.8
4.2
0.8 Pitch
Filled via
ø0.1
ø0.4
Products should be located in the sideways direction
(Length: a<b) to the mechanical stress.
Small diameter thru hole ø0.2
Poor example
o Reflow and Flow NFW31S
o Reflow Soldering NFE31P
o Flow Soldering
NFp Chip EMIFILr
Small diameter thru hole ø0.4
1.5
3.8
4.8
9.0
Small diameter thru hole ø0.4
0.6
1.2
2.2
4.2
NFA21S
0.25
Soldering and Mounting
2.5
1.5
0.25
Good example
b
Land Pattern
+ Solder Resist
Land Pattern
Solder Resist
a
(in mm)
Mar.28,2011
C31E.pdf