BLM18KG471SN1D Murata, BLM18KG471SN1D Datasheet - Page 144
![EMI/RFI Suppressors & Ferrites 0603 470ohms 1.5A](/photos/16/33/163379/pc0_4800_sml.jpg)
BLM18KG471SN1D
Manufacturer Part Number
BLM18KG471SN1D
Description
EMI/RFI Suppressors & Ferrites 0603 470ohms 1.5A
Manufacturer
Murata
Datasheet
1.BLM18EG121SN1-D.pdf
(209 pages)
Specifications of BLM18KG471SN1D
Product
Chip Ferrite Beads
Impedance
470 Ohms
Maximum Dc Current
1500 mAmps
Maximum Dc Resistance
0.13 Ohms
Operating Temperature Range
- 55 C to + 125 C
Package / Case
0603 (1608 metric)
Termination Style
SMD/SMT
Dc Resistance Max
0.13ohm
Dc Current Rating
1.5A
Ferrite Mounting
SMD
Ferrite Case Style
0603 / 1608
External Width
1.6mm
Operating Temperature Max
125°C
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
BLM18KG471SN1D
Manufacturer:
Murata Electronics North Ameri
Quantity:
36 803
Part Number:
BLM18KG471SN1D
Manufacturer:
MURATA/村田
Quantity:
20 000
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!Note
142
NFW31S
NFE31P
NFE61P
NFA
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.
Series
oGuideline of solder paste thickness:
oGuideline of solder paste thickness:
oGuideline of solder paste thickness:
100-200 m: NFA31G/31C
100-150 m: NFA18S/21S
150-200 m
150-200 m
0.25
NFA21S
NFA18S
NFA31G/31C
0.175
0.5
0.05
Solder Paste Printing
0.3
1.5
0.25
1.375
1.3
2.0
0.4
1.5
4.8
8.8
0.5
2.6
0.6
2.2
4.2
0.225
0.8 Pitch
0.6
Apply 1.0mg of bonding agent at each chip.
NFW31S Series
Apply 0.2mg of bonding agent at each chip.
NFp Chip EMIFILr
Bonding agent
Bonding agent
Adhesive Application
Soldering and Mounting
Bonding agent
1.5
4.8
9.0
Coating positon of
bonding agent
(in mm)
Mar.28,2011
C31E.pdf
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