T528Z477M2R5ATE009 Kemet, T528Z477M2R5ATE009 Datasheet - Page 8
![Tantalum Capacitors - Polymer SMD 2.5volt 470uF ESR=9 Z case 20%](/photos/16/33/163309/t528_sml.jpg)
T528Z477M2R5ATE009
Manufacturer Part Number
T528Z477M2R5ATE009
Description
Tantalum Capacitors - Polymer SMD 2.5volt 470uF ESR=9 Z case 20%
Manufacturer
Kemet
Series
T528r
Datasheet
1.T528Z337M2R5ATE009.pdf
(16 pages)
Specifications of T528Z477M2R5ATE009
Voltage Rating
2.5 Volts
Esr
9 mOhms
Operating Temperature Range
- 55 C to + 125 C
Mfr Case Code
Z Case
Dimensions
4.3 mm W x 7.3 mm L x 1.7 mm H
Dissipation Factor Df
10
Product
Tantalum Organic Polymer Standard Grade
Termination Style
SMD/SMT
Capacitance
470 uF
Tolerance
20 %
Package / Case
Case Z
Capacitance Tolerance
± 20%
Capacitor Case Style
2917
Msl
MSL 3 - 168 Hours
Capacitor Mounting
SMD
Termination Type
SMD
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
KEMET Organic Capacitor (KO-CAP) – T528 Low ESL/Facedown Terminal Polymer Tantalum
Soldering Process
KEMET’s families of surface mount tantalum capacitors are
compatible with wave (single or dual), convection, IR or vapor
phase reflow techniques. Preheating of these components
is recommended to avoid extreme thermal stress. KEMET's
recommended profile conditions for convection and IR reflow reflect
the profile conditions of the IPC/J-STD-020D standard for moisture
sensitivety testing. The devices can safely withstand a maximum of
three reflow passes at these conditions.
Note that although the X/7343-43 case size can withstand wave
soldering, the tall profile (4.3mm maximum) dictates care in wave
process development.
Note 1: All temperatures refer to the center of the package, measured on the
package body surface that is facing up during assembly reflow.
* Case Size D, E, P, Y and X
**Case Size A, B, C, H, I, K, M, R, S, T, U, V, W and Z
Construction
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
Tantalum
Time 25°C to peak temperature
Time within 5°C of max peak
Liquidous temperature (T
Time (t
Ramp-down rate (T
Time above liquidous (t
Temperature Max (T
Profile Feature
Temperature Min (T
Ramp-up rate (T
Peak Temperature (T
Wire
Leadframe
(+Anode)
temperature (t
Washer
Preheat/Soak
Weld
s
) from T
smin
L
to T
to T
P
P
)
to T
Smin
Smax
smax
P
P
Tantalum
L
)
)
)
)
)
L
L
)
)
)
Ta
2
O
5
Sn-Pb Assembly
6 minutes max
3°C/sec max
6°C/sec max
Polymer
20 sec max
60-120 sec
60-150 sec
235°C**
220°C*
100°C
150°C
183°C
Carbon
Epoxy
Pb-Free Assembly
Silver Paint
8 minutes max
3°C/sec max
6°C/sec max
30 sec max
60-120 sec
60-150 sec
260°C**
250°C*
150°C
200°C
217°C
T
T
25
Leadframe
(-Cathode)
smax
smin
T
T
P
L
Max Ramp Up Rate = 3 ° C/sec
Max Ramp Down Rate = 6 ° C/sec
Time/Temperature Soldering Profile
25° C to Peak
t
S
Time
T2018-1 • 1/17/2011
t
L
t
P
8 8