B32673Z5105K EPCOS Inc, B32673Z5105K Datasheet - Page 14

• Manufacturer Part Number: B32673Z5105K
• Description: Polypropylene Film Capacitors 1.0uF 520volts 10%
• Manufacturer: EPCOS Inc
• Series: B32673Zr

Specifications of B32673Z5105K

• Voltage Rating: 520 Volts
• Termination Style: Radial
• Dimensions: 10.5 mm W x 26.5 mm L x 20.5 mm H
• Dissipation Factor Df: 1
• Load Life: 200000 Hrs
• Product: Metallized Polypropylene Capacitors
• Capacitance: 1 uF
• Tolerance: 10 %
• Lead Spacing: 22.5 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

1.3
Permissible heat exposure loads on film capacitors are primarily characterized by the upper cate-
gory temperature T
can lead to changes in the plastic dielectric and thus change irreversibly a capacitor's electrical
characteristics. For short exposures (as in practical soldering processes) the heat load (and thus
the possible effects on a capacitor) will also depend on other factors like:
The overheating associated with some of these factors can usually be reduced by suitable coun-
termeasures. For example, if a pre-heating step cannot be avoided, an additional or reinforced
cooling process may possibly have to be included.
EPCOS recommends the following conditions:
Uncoated capacitors
For uncoated MKT capacitors with lead spacings 10 mm (B32560/B32561) the following mea-
sures are recommended:
Please read Cautions and warnings and
Important notes at the end of this document.
Pre-heating temperature and time
Forced cooling immediately after soldering
Terminal characteristics:
diameter, length, thermal resistance, special configurations (e.g. crimping)
Height of capacitor above solder bath
Shadowing by neighboring components
Additional heating due to heat dissipation by neighboring components
Use of solder-resist coatings
Pre-heating with a maximum temperature of 110 C
Temperature inside the capacitor should not exceed the following limits:
When SMD components are used together with leaded ones, the leaded film capacitors should
not pass into the SMD adhesive curing oven. The leaded components should be assembled af-
ter the SMD curing step.
Leaded film capacitors are not suitable for reflow soldering.
pre-heating to not more than 110 C in the preheater phase
rapid cooling after soldering
MKP/MFP 110 C
MKT 160 C
General notes on soldering
B32671Z ... B32673Z
Power Factor Correction
max
. Long exposure to temperatures above this type-related temperature limit
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