MMA7455LR1 Freescale Semiconductor, MMA7455LR1 Datasheet - Page 29
![Board Mount Accelerometers 3-AXIS DIGITAL 2 4 8G](/photos/16/15/161593/mma7450photo_sml.jpg)
MMA7455LR1
Manufacturer Part Number
MMA7455LR1
Description
Board Mount Accelerometers 3-AXIS DIGITAL 2 4 8G
Manufacturer
Freescale Semiconductor
Datasheet
1.MMA7455LT.pdf
(35 pages)
Specifications of MMA7455LR1
Sensing Axis
X, Y, Z
Acceleration
2 g, 4 g, 8 g
Digital Output - Number Of Bits
8 bit, 10 bit
Supply Voltage (max)
3.6 V
Supply Voltage (min)
2.4 V
Supply Current
400 uA
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Sensitivity
64 LSB/g
Package / Case
LGA-14
Output Type
Digital
Acceleration Range
± 2g, ± 4g, ± 8g
No. Of Axes
3
Ic Interface Type
I2C, SPI
Sensor Case Style
LGA
No. Of Pins
14
Supply Voltage Range
2.4V To 3.6V
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MMA7455LR1
Manufacturer:
ON
Quantity:
12 000
Company:
Part Number:
MMA7455LR1
Manufacturer:
FSL
Quantity:
3 000
Part Number:
MMA7455LR1
Manufacturer:
FREESCALE
Quantity:
20 000
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the
correct size to ensure proper solder connection interface between the board and the package.
With the correct footprint, the packages will self-align when subjected to a solder reflow process. It is always recommended to
design boards with a solder mask layer to avoid bridging and shorting between solder pads.
SOLDERING AND MOUNTING GUIDELINES FOR THE LGA ACCELEROMETER SENSOR TO A PC BOARD
These guideline are for soldering and mounting the LGA package inertial sensors to printed circuit boards (PCBs). The purpose
is to minimize the stress on the package after board mounting. The MMA7455L digital output accelerometer uses the Land Grid
Array (LGA) package platform. This section describes suggested methods of soldering these devices to the PC board for con-
sumer applications.
Sensors
Freescale Semiconductor
Figure 18
Figure 18. Recommended PCB Land Pattern for the 5 x 3 mm LGA Package
shows the recommended PCB land pattern for the package.
MMA7455L
29