LFX125EB-04FN256C Lattice, LFX125EB-04FN256C Datasheet - Page 16

• Manufacturer Part Number: LFX125EB-04FN256C
• Description: FPGA - Field Programmable Gate Array E-Ser139K Gt ispJTAG 2.5/3.3V -4 Spd
• Manufacturer: Lattice

Specifications of LFX125EB-04FN256C

• Number Of Macrocells: 1936
• Number Of Programmable I/os: 160
• Data Ram Size: 94208
• Supply Voltage (max): 3.6 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: 0 C
• Mounting Style: SMD/SMT
• Supply Voltage (min): 1.65 V
• Number Of Gates: 139 K
• Package / Case: FPBGA-256
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Lattice Semiconductor
The second type of interface implemented is the terminated, single-ended interface standard. This group of inter-
faces includes different versions of SSTL and HSTL interfaces along with CTT, and GTL+. Usage of these particu-
lar I/O interfaces requires an additional V
Typically an output will be terminated to V
The third type of interface standards are the differential standards LVDS, BLVDS, and LVPECL. The differential
standards require two I/O pins to create the differential pair. The logic level is determined by the difference in the
two signals. Table 6 lists how these interface standards are implemented in the ispXPGA devices.
For more information on sysIO capability, refer to Lattice technical note number TN1000, sysIO Usage Guidelines
for Lattice Devices available at www.latticesemi.com.
Figure 19. sysIO Banks per Device
Table 4. Number of I/Os per Bank
V
V
V
V
CCO0
GND
CCO1
GND
REF0
REF1
XPGA 1200
XPGA 500
XPGA 200
XPGA 125
I/O N
I/O N
I/O 0
I/O 0
Device
REF
TT
Bank 7
Bank 2
at the receiving end of the transmission line it is driving.
signal. At the system level a termination voltage, V
Max. Number of I/Os per Bank (N)
16
Bank 6
Bank 3
62
42
26
22
ispXPGA Family Data Sheet
I/O N
I/O N
I/O 0
I/O 0
V
V
GND
V
V
GND
CCO5
REF5
CCO4
REF4
TT
, is also required.