AP-FM002GED0D5S-MPJ Apacer, AP-FM002GED0D5S-MPJ Datasheet - Page 3

• Manufacturer Part Number: AP-FM002GED0D5S-MPJ
• Description: Memory Modules ADMIII-40pin midprof 2GB
• Manufacturer: Apacer

Specifications of AP-FM002GED0D5S-MPJ

• Product: Modules Miscellaneous
• Operating Supply Voltage: 5 V
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: 0 C
• Memory Size: 2 GB
• Memory Type: ATA Disk Module
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

1. GENERAL DESCRIPTION ......................................................................................... 3
2. FUNCTIONAL BLOCK ............................................................................................... 4
3. PIN ASSIGNMENTS ................................................................................................... 5
4. CAPACITY SPECIFICATION ..................................................................................... 6
5. FLASH MANAGEMENT ............................................................................................. 8
6. SOFTWARE INTERFACE ....................................................................................... 10
7. ELECTRICAL SPECIFICATION .............................................................................. 12
8. PHYSICAL CHARACTERISTICS ............................................................................ 13
9. PRODUCT ORDERING INFORMATION ................................................................. 16
© 2010 Apacer Technology Inc.
1.1 P
4.1 P
4.2 E
5.1 I
5.2 I
5.3 E
6.1 C
8.1 D
9.1 P
9.2 V
1.1.1 Power Management Unit (PMU)............................................................................................... 3
1.1.2 SRAM Buffer............................................................................................................................ 3
5.1.1 Advanced wear-leveling algorithms .......................................................................................... 8
5.1.2 S.M.A.R.T. technology ............................................................................................................. 8
5.1.3 Built-in hardware ECC.............................................................................................................. 8
5.1.4 Enhanced data integrity ........................................................................................................... 8
5.3.1 Secure protection zone ............................................................................................................ 9
5.3.2 Quick erase ............................................................................................................................. 9
8.1.1 40 pin/ 180 degree middle profile w/o housing ....................................................................... 13
8.1.2 40 pin/ 180 degree middle profile w/housing.......................................................................... 14
9.2.1 Standard MP.......................................................................................................................... 17
9.2.2 Hi-Speed MP ......................................................................................................................... 17
9.2.3 Extended Temperature Standard MP ..................................................................................... 17
9.2.4 Extended Temperature Hi-Speed MP..................................................................................... 17
9.2.5 Standard M2H........................................................................................................................ 18
9.2.6 Hi-Speed M2H ....................................................................................................................... 18
9.2.7 Extended Temperature Standard M2H ................................................................................... 18
9.2.8 Extended Temperature Hi-Speed M2H................................................................................... 18
NTELLIGENT
NTELLIGENT
ERFORMANCE
ERFORMANCE
NVIRONMENTAL
NHANCED
RODUCT
ALID
OMMAND
IMENSION
C
OMBINATIONS
C
S
S
.................................................................................................................................... 13
ODE
ET
E
P
ECURITY
NDURANCE
OWER
-O
............................................................................................................................... 10
S
D
PECIFICATION
S
PTIMIZED
ESIGNATIONS
PECIFICATION
F
..................................................................................................................... 17
L
AILURE
EVEL
Value Added ATA-Disk Module Ⅲ
D
AP-FMxxxxEDXXXS-MPXXXJ
C
ESIGN
Table of Contents
............................................................................................................. 9
ONTROLLER
R
.......................................................................................................... 6
....................................................................................................... 16
ECOVERY
........................................................................................................ 7
...................................................................................................... 8
........................................................................................... 3
........................................................................................... 9
2
Rev. 1.2