EC103M1 Littelfuse Inc, EC103M1 Datasheet - Page 3

• Manufacturer Part Number: EC103M1
• Description: SCRs 600V .8A 12uA Sensing
• Manufacturer: Littelfuse Inc

Specifications of EC103M1

• Breakover Current Ibo Max: 20 A
• Rated Repetitive Off-state Voltage Vdrm: 600 V
• Off-state Leakage Current @ Vdrm Idrm: 0.002 mA
• On-state Rms Current (it Rms): 0.8 A
• Forward Voltage Drop: 1.7 V
• Gate Trigger Voltage (vgt): 0.8 V
• Maximum Gate Peak Inverse Voltage: 1.2 V
• Gate Trigger Current (igt): 12 uA
• Holding Current (ih Max): 5 mA
• Mounting Style: Through Hole
• Package / Case: TO-92
• Maximum Operating Temperature: + 110 C
• Minimum Operating Temperature: - 65 C
• Configuration: Thyristor
• Current Squared Time Rating: 1.6
• Current, Forward: 0.8 A
• Current, Reverse: 1 μA
• Current, Surge: 20 A
• Package Type: TO-92
• Primary Type: SCR
• Resistance, Thermal, Junction To Case: 75 °C/W
• Temperature, Junction, Maximum: +110 °C
• Temperature, Operating: -40 to +110 °C
• Voltage, Forward: 1.7 V
• Voltage, Reverse: 600 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

EC103xx & SxSx Series
Soldering Parameters
Reflow Condition
Pre Heat
Average ramp up rate (Liquidus Temp)
(T
T
Reflow
Peak Temperature (T
Time within 5°C of actual peak
Temperature (t
Ramp-down Rate
Time 25°C to peak Temperature (T
Do not exceed
Physical Specifications
Terminal Finish
Body Material
Lead Material
Design Considerations
Careful selection of the correct device for the application’s
operating parameters and environment will go a long way
toward extending the operating life of the Thyristor. Good
design practice should limit the maximum continuous
current through the main terminals to 75% of the device
rating. Other ways to ensure long life for a power discrete
semiconductor are proper heat sinking and selection of
voltage ratings for worst case conditions. Overheating,
overvoltage (including dv/dt), and surge currents are
the main killers of semiconductors. Correct mounting,
soldering, and forming of the leads also help protect
against component damage.
S(max)
L
) to peak
to T
L
- Ramp-up Rate
- Temperature Min (T
- Temperature Max (T
- Time (min to max) (t
- Temperature (T
- Temperature (t
p
)
P
)
100% Matte Tin-plated/Pb-free Solder
Dipped
UL recognized epoxy meeting flammability
classification 94V-0
Copper Alloy
L
L
)
) (Liquidus)
s(min)
s(max)
s
)
P
)
)
)
Pb – Free assembly
150°C
200°C
60 – 190 secs
5°C/second max
5°C/second max
217°C
60 – 150 seconds
260
20 – 40 seconds
5°C/second max
8 minutes Max.
280°C
Teccor
+0/-5
°C
®
0.8 Amp Sensitive SCRs
brand Thyristors
168
AC Blocking
Temperature Cycling
Temperature/
Humidity
High Temp Storage
Low-Temp Storage
Thermal Shock
Autoclave
Resistance to
Solder Heat
Solderability
Lead Bend
Environmental Specifications
T
T
S(max)
S(min)
25
T
T
Test
P
L
time to peak temperature
t
MIL-STD-750, M-1040, Cond A Applied
Peak AC voltage @ 110°C for 1008 hours
MIL-STD-750, M-1051,
100 cycles; -40°C to +150°C; 15-min
dwell-time
EIA / JEDEC, JESD22-A101
1008 hours; 320V - DC: 85°C; 85%
rel humidity
MIL-STD-750, M-1031,
1008 hours; 150°C
1008 hours; -40°C
MIL-STD-750, M-1056
10 cycles; 0°C to 100°C; 5-min dwell-
time at each temperature; 10 sec (max)
transfer time between temperature
EIA / JEDEC, JESD22-A102
168 hours (121°C at 2 ATMs) and
100% R/H
MIL-STD-750 Method 2031
ANSI/J-STD-002, category 3, Test A
MIL-STD-750, M-2036 Cond E
S
Preheat
Preheat
Specifications and Conditions
Ramp-up
Ramp-up
t
t
P
L
Ramp-down
Ramp-do
Time