ECG001F-G TriQuint, ECG001F-G Datasheet - Page 4

• Manufacturer Part Number: ECG001F-G
• Description: RF Amplifier DC-6 GHz 22dB Gain at 1 GHz
• Manufacturer: TriQuint
• Type: Buffer Amplifierr

Specifications of ECG001F-G

• Mounting Style: SMD/SMT
• Number Of Channels: 1
• Operating Frequency: 6000 MHz
• Noise Figure: 3.4 dB @ 2000 MHz
• Operating Supply Voltage: 3.4 V
• Supply Current: 30 mA (Typ) @ 5 V
• Maximum Operating Temperature: + 250 C
• Minimum Operating Temperature: - 40 C
• Package / Case: SOT-363
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 1066898

TriQuint Semiconductor, Inc
ECG001F
InGaP HBT Gain Block
This package is lead-free/Green/RoHS-compliant. The plating material on the leads is annealed matte tin over copper. It is compatible with
both lead-free (maximum 260 C reflow temperature) and leaded (maximum 245 C reflow temperature) soldering processes.
Phone [phone]
Outline Drawing
Land Pattern
ECG001F-G Mechanical Information
FAX: [phone]
XX4
e-mail: [e-mail]
Web site: www.TriQuint.com
Specifications and information are subject to change without notice
The component will be marked with a two-digit
numeric lot code (shown as “XX”) followed
with a “4” designator on the top surface of the
package.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
ESD Rating: Class 1A
Value:
Test:
Standard:
MSL Rating: Level 3 at +260 C convection reflow
Standard:
1. Ground / thermal vias are critical for the proper performance of this
2. Add as much copper as possible to inner and outer layers near the
3. Mounting screws can be added near the part to fasten the board to a
4. Do not put solder mask on the backside of the PC board in the
5. RF trace width depends upon the PC board material and
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in degrees.
Mounting Config. Notes
device. Vias should use a .35mm (#80 / .0135”) diameter drill and
have a final plated thru diameter of .25 mm (.010”).
part to ensure optimal thermal performance.
heatsink. Ensure that the ground / thermal via region contacts the
heatsink.
region where the board contacts the heatsink.
construction.
MSL / ESD Rating
Product Marking
Passes between 250 and 500V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
JEDEC Standard J-STD-020
Page 4 of 5 August 2009