EASYBEE_SO Flexipanel, EASYBEE_SO Datasheet - Page 5

• Manufacturer Part Number: EASYBEE_SO
• Description: Zigbee / 802.15.4 Modules & Development Tools 2.4GHz trnsvr Module SO package
• Manufacturer: Flexipanel

Specifications of EASYBEE_SO

• Wireless Frequency: 2.4 GHz
• Interface Type: SPI
• Modulation: DSSS OQPSK
• Security: Authentication, Encryption
• Operating Voltage: + 2.1 V to + 3.6 V
• Output Power: 1 mW
• For Use With/related Products: CC2420

Location on main board
The module should be located so that the antenna abuts
the edge of the board or overhangs it. It should be
placed so that it is unlikely that interfering items such as
metal, water, cellphones, body tissue, etc, can come
into close proximity.
It is recommended that tracks and components are not
placed in PCB layers below the module. However, if
space limitations require it, leave the surface in contact
with the module uncoppered and place a grounded fill in
the layer immediately below. Any vias that might come
in contact with the module should be completely
covered with resist to avoid shorting to vias on the
module.
grounded copper fill as possible in order to reduce
circuit noise.
Enclosures
Metal enclosures are not recommended for attenuation
reasons. If one must be used, aim to put as many holes
in it as possible at least 3cm long.
For mains isolation and intrinsic safety applications,
potting in a shallow layer of clear potting compound is
recommended. A 5mm layer of potting compound (RS
Components p/n 199-1468) has been measured to
attenuate the signal by approximately 3dB. LEDs can
be clearly seen through the potting compound and bind
switches, etc, can be implemented using reed switches.
For all-weather and external mounting applications,
contact us for a range of ‘puck’ module enclosures.
Bibliography
CC2420 Data Sheet, downloadable from
www.chipcon.com.
ZigBee for Applications Developers, white paper
downloadable from www.flexipanel.com.
Pixie Data Sheet, downloadable from
www.flexipanel.com.
p5
4. Starting with the pads most likely to be in physical
5. Test for continuity between the pad on the upper
6. Rework non-conducting contacts by applying heat
contact, apply heat with a soldering iron to the
exposed part of the main board pads. Abut the iron
against the edge of the module so that the heat is
transmitted to the contact area of the pads. After
10-15 seconds, remove heat. Around 90% of pads
should be successfully soldered.
side of the board and the protruding part of the pad
on the main board.
again and a little extra solder.
17-Mar-08
The main board should contain as much
EasyBee DS480-14
© FlexiPanel Ltd
PICDEM Z User Guide, downloadable from
www.microchip.com.
AN965 Microchip Stack for the ZigBee Protocol,
application note, downloadable from
www.microchip.com.
Microchip Stack for ZigBee Protocol, supplementary
notes included with the Microchip Stack for ZigBee
firmware downloadable from www.microchip.com.
Patents may apply and/or pending
www.FlexiPanel.com