AH2-PCB TriQuint, AH2-PCB Datasheet - Page 5

• Manufacturer Part Number: AH2-PCB
• Description: RF Modules & Development Tools 50-860MHz Eval Brd 20dBm
• Manufacturer: TriQuint

Specifications of AH2-PCB

• Minimum Frequency: 50 MHz
• Minimum Operating Temperature: - 40 C
• Supply Voltage (min): 5 V
• Product: RF Modules
• Maximum Frequency: 1 GHz
• Supply Voltage (max): 6 V
• Supply Current: 150 mA
• Maximum Operating Temperature: + 85 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 1067231

WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: [phone] • e-mail: [e-mail] • Web site: www.wj.com, www.TriQuint.com
Thermal Specifications
1. The thermal resistance is referenced from the hottest
2. This corresponds to the typical biasing condition of
Parameter
Operating Case Temperature
Thermal Resistance, Rth
Junction Temperature, Tj
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260 °C reflow temperature) and leaded
part of the junction to the ground tab (pin 4).
+5V, 150 mA at an 85 °C case temperature.
minimum MTTF of 1 million hours is achieved for
junction temperatures below 160 °C.
AH2-G (Green / Lead-free SOT-89 Package) Mechanical Information
AH2
High Dynamic Range Amplifier
(maximum 245 °C reflow temperature) soldering processes. The plating material on the leads is NiPdAu.
(1)
(2)
Outline Drawing
Land Pattern
Rating
-40 to +85 °C
59 °C / W
129 °C
A
1000
100
10
1
60
MTTF vs. GND Tab Temperature
70
Tab Temperature (°C)
80
90
100
110
Specifications and information are subject to change without notice.
The AH2-G will be marked with an “AH2G”
designator.
(“XXXX-X”) is also marked below the part
designator on the top surface of the package.
The obsolete tin-lead package is marked with
an “AH2” designator followed by an
alphanumeric lot code.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
ESD Rating: Class 1B
Value:
Test:
Standard:
ESD Rating: Class IV
Value:
Test:
Standard:
MSL Rating: Level 3 at +260 °C convection reflow
Standard:
1. Ground / thermal vias are critical for the proper
2. Add as much copper as possible to inner and outer
3. Mounting screws can be added near the part to fasten
4. Do not put solder mask on the backside of the PC board
5. RF trace width depends upon the PC board material
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are
Mounting Config. Notes
performance of this device. Vias should use a .35mm
(#80 / .0135”) diameter drill and have a final plated
thru diameter of .25 mm (.010”).
layers near the part to ensure optimal thermal
performance.
the board to a heatsink.
thermal via region contacts the heatsink.
in the region where the board contacts the heatsink.
and construction.
in degrees.
MSL / ESD Rating
Product Marking
Passes
Human Body Model (HBM)
JEDEC Standard JESD22-A114
Passes
Charged Device Model (CDM)
JEDEC Standard JESD22-C101
JEDEC Standard J-STD-020
An alphanumeric lot code
Product Information
500V to <1000V
1000V to <2000V
Ensure that the ground /
Page 5 of 5 June 2006