AH22S-PCB TriQuint, AH22S-PCB Datasheet - Page 4

• Manufacturer Part Number: AH22S-PCB
• Description: RF Modules & Development Tools Push-Pull Eval Brd 11dB Gain
• Manufacturer: TriQuint

Specifications of AH22S-PCB

• Board Size: 6.2 mm x 5 mm x 1.62 mm
• Minimum Frequency: 50 MHz
• Minimum Operating Temperature: - 40 C
• Supply Voltage (min): 5 V
• Product: RF Modules
• Maximum Frequency: 1 GHz
• Supply Voltage (max): 6 V
• Supply Current: 160 mA
• Maximum Operating Temperature: + 85 C
• For Use With/related Products: AH22S
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 1067398

Thermal Specifications
Notes:
1. The thermal resistance is referenced from the hottest
2. This corresponds to the typical biasing condition of
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: [phone] • e-mail: [e-mail] • Web site: www.wj.com, www.TriQuint.com
Parameter
Operating Case Temperature
Thermal Resistance
Junction Temperature
part of the junction to ground tab underneath the
device.
+5V, 320 mA at an 85 °C case
minimum MTTF of 1 million hours is achieved for
junction temperatures below 160 °C.
This package is lead-free/green/RoHS-compliant. The plating material on the leads is NiPdAu. It is compatible with both lead-free
AH22S
High Dynamic Range CATV Amplifier
(maximum 260 °C reflow temperature) and lead (maximum 245 °C reflow temperature) soldering processes.
AH22S-G (Lead-Free Package) Mechanical Information
(1)
, Rth
(2)
, Tj
Outline Drawing
Land Pattern
temperature.
Rating
-40 to +85 °C
28 °C/W
130 °C
A
1000
100
10
1
60
MTTF vs. GND Tab Temperature
70
Tab Temperature (°C)
80
90
100
110
Specifications and information are subject to change without notice.
The component will be marked with an
“AH22SG” designator with an alphanumeric lot
code on the top surface of the package. The
obsolete tin-lead package is marked with an
“AH22S”
alphanumeric lot code.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
The backside paddle is the Source and should be
grounded for thermal and electrical purposes.
ESD Rating: Class 1B
Value:
Test:
Standard:
ESD Rating: Class IV
Value
Test:
Standard:
MSL Rating: Level 2 at +260 °C convection reflow
Standard:
1.
2.
3.
4.
5.
6.
7.
8.
9.
Mounting Config. Notes
ESD / MSL Information
Functional Pin Layout
Ground / thermal vias are critical for the proper performance
of this device.
diameter drill and have a final plated through diameter of
.25mm (.010”)
Add as much copper as possible to inner and outer layers near
the part to ensure optimal thermal performance.
To ensure reliable operation, device ground paddle-to-ground
pad solder joint is critical.
Add mounting screws near the part to fasten the board to a
heatsink. Ensure that the ground / thermal via region contacts
the heatsink.
For optimal thermal performance, expose soldermask on
backside where it contacts the heatsink.
RF trace width depends upon the PC board material and
construction.
Use 1 oz. Copper minimum.
If the PCB design rules allow, ground vias should be placed
under the land pattern for better RF and thermal performance.
Otherwise ground vias should be placed as close to the land
pattern as possible.
All dimensions are in mm. Angles are in degrees.
Product Marking
Pin
1
2
3
4
5
6
7
8
designator
Passes from 500 to 1000 V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
Passes greater than 1000 V
Charge Device Model (CDM)
JEDEC Standard JESD22-C101
JEDEC Standard J-STD-020A
Product Information
Function
RF input (Amp1 input)
Ground
Ground
RF input (Amp2 input)
RF output (Amp2 output)
Ground
Ground
RF output (Amp1 output)
Vias should use a .35mm (#80/.0135”)
followed
Page 4 of 4 April 2006
by
an