VEMD2000X01 Vishay, VEMD2000X01 Datasheet - Page 4

Photodiodes PIN Photo Diode

VEMD2000X01

Manufacturer Part Number
VEMD2000X01
Description
Photodiodes PIN Photo Diode
Manufacturer
Vishay
Type
PIN Photodioder
Datasheet

Specifications of VEMD2000X01

Photodiode Material
Silicon
Peak Wavelength
940 nm
Half Intensity Angle Degrees
15 deg
Maximum Reverse Voltage
60 V
Maximum Power Dissipation
215 mW
Maximum Light Current
12 uA
Maximum Dark Current
10 nA
Maximum Rise Time
100 ns
Maximum Fall Time
100 ns
Wavelength Typ
940nm
Half Angle
15°
Dark Current
1nA
Diode Case Style
SMD
No. Of Pins
2
Operating Temperature Range
-40°C To +100°C
Reverse Voltage Vr
60V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
VEMD2000X01
Manufacturer:
VISHAY/威世
Quantity:
20 000
Company:
Part Number:
VEMD2000X01
Quantity:
70 000
VEMD2000X01, VEMD2020X01
Vishay Semiconductors
REFLOW SOLDER PROFILE
PACKAGE DIMENSIONS in millimeters: VEMD2000
www.vishay.com
4
Fig. 7 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020D
19841
300
250
200
150
100
50
0
0
255 °C
240 °C
217 °C
max. ramp up 3 °C/s max. ramp down 6 °C/s
50
max. 120 s
100
Drawing-No.: 6.544-5391.02-4
Issue: 2; 18.03.10
21517
Time (s)
150
Cathode
For technical questions, contact:
1.7
max. 100 s
max. 30 s
200
max. 260 °C
250
245 °C
Pin ID
2.3 ± 0.2
5.8 ± 0.2
0.4
2.2
6.7
300
Silicon PIN Photodiode
Solder pad proposal
acc. IPC 7351
Z
Ø 2.3 ± 0.1
Anode
detectortechsupport@vishay.com
exposed copper
DRYPACK
Devices are packed in moisture barrier bags (MBB) to
prevent the products from moisture absorption during
transportation and storage. Each bag contains a desiccant.
FLOOR LIFE
Floor life (time between soldering and removing from MBB)
must not exceed the time indicated on MBB label:
Floor life: 4 weeks
Conditions: T
Moisture sensitivity level 2a, acc. to J-STD-020.
DRYING
In case of moisture absorption devices should be baked
before soldering. Conditions see J-STD-020 or label.
Devices taped on reel dry using recommended conditions
192 h at 40 °C (+ 5 °C), RH < 5 %.
Z 20:1
amb
Ø 1.8 ± 0.1
2.2
Not indicated tolerances ± 0.1
< 30 °C, RH < 60 %
technical drawings
according to DIN
specifications
1.1 ± 0.1
Document Number: 81962
Rev. 1.2, 22-Mar-11

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