SWT821-S Seoul Semiconductor Inc, SWT821-S Datasheet

Standard LED - SMD White 5500mcd 3.2V 60mA

SWT821-S

Manufacturer Part Number
SWT821-S
Description
Standard LED - SMD White 5500mcd 3.2V 60mA
Manufacturer
Seoul Semiconductor Inc
Datasheet

Specifications of SWT821-S

Led Size
3.2 mm x 2.8 mm
Illumination Color
White
Operating Voltage
3.2 V
Luminous Intensity
5500 mcd
Mounting Style
SMD/SMT
Operating Current
60 mA
Color Temperature
4800 K to 10000 K
Lens Shape
Flat Round
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Viewing Angle
120 deg
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
SWT821-S-Z2NOD1
Quantity:
2 074
Specification
SWT821-S
SSC
CUSTOMER
Drawn
Approval
Approval
Rev. 04
Rev. 04
March 2010
March 2010
www.acriche.com
www.acriche.com
SSC-QP-7-07-24 (Rev.00)

Related parts for SWT821-S

SWT821-S Summary of contents

Page 1

... Specification SWT821-S SSC Drawn Approval CUSTOMER Approval www.acriche.com www.acriche.com SSC-QP-7-07-24 (Rev.00) Rev. 04 Rev. 04 March 2010 March 2010 ...

Page 2

CONTENTS 1. Description 2. Absolute Maximum Ratings 3. Electro-Optical Characteristics 4. Optical characteristics 5. Reliability Test 6. Color & Binning 7. Bin Code Description 8. Outline Dimension 9. Reel Structure 10. Packing 11. Soldering 12. Precaution for use 13. Handling ...

Page 3

... Furthermore, its thermal management characteristic is better than other LED solutions by package SMD design and good thermal emission material. According to these advantages, it enables to apply various lighting applications and design solution, automotive lighting etc. SWT821-S Features • White colored SMT package. • Pb-free Reflow Soldering Application • ...

Page 4

Absolute maximum ratings Parameter Power Dissipation Forward Current Peak Forward Current (per die) Reverse Voltage (per die) Operating Temperature Storage Temperature Junction Temperature [1] Care taken that power dissipation does not exceed the absolute maximum rating ...

Page 5

Optical characteristics Forward Voltage vs. Forward Current (Per die 2.6 2.8 3.0 3.2 3.4 3.6 Forward Voltage V [V] F Ambient Temperature vs. Maximum Forward Current (per die) 35 ...

Page 6

Optical characteristics Spectrum 1.0 0.8 0.6 0.4 0.2 0.0 300 400 500 600 Wavelength [nm] Ta=25℃, I =60mA F 700 800 Rev. 04 Rev. 04 March 2010 March 2010 www.acriche.com www.acriche.com SSC-QP-7-07-24 (Rev.00) ...

Page 7

Reliability Test Item Reference EIAJ Thermal Shock ED-4701 High Temperature EIAJ Storage ED-4701 High Temp. High EIAJ Humidity Storage ED-4701 Low Temperature EIAJ Storage ED-4701 Operating Internal Endurance Test Reference High Temperature Internal High Humidity Life Reference Test High ...

Page 8

Color & Binning 0.9 520 525 515 530 0.8 535 540 510 0.7 505 0.6 500 0.5 495 0.4 0.3 490 0.2 485 480 0.1 475 470 460 0.0 0.0 0.1 0.2 545 550 555 560 565 570 575 ...

Page 9

Color & Binning 0.38 0.36 0.34 0.32 8200K 10000K 0.30 0.28 0.26 0.24 0.27 0.28 ● COLOR RANK 0.3 0.281 0.295 0.31 0.2935 0.3065 0.3065 0.3104 0.303 0.295 0.295 0.289 0.32 ...

Page 10

Bin Code Description §.Rank Name §.Forward Voltage[V] rank min name Z1 3.0 Z2 3.1 Z3 3.2 A1 3.3 A2 3.4 §.Luminous Intensity [IV] rank min name M 4000 N 5000 [Note] All measurements were made ...

Page 11

Outline Dimension 2. ATTENTION MARKING ON LED IS COMMON ANODE(+) Packing Mark (Anode) 9. Reel Structure 2 .0 ± ±0 .1 ± 0.2 2.0 22 (1) Quantity : 2000pcs/Reel ...

Page 12

Packing Reel QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : SEOUL SEMICONDUCTOR CO., LTD. HUMIDITY INDICATOR Aluminum Vinyl Bag QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : SEOUL SEMICONDUCTOR CO., LTD. Outer Box Structure Material ...

Page 13

Soldering (1) Lead Solder Lead Solder Pre-heat 120~150℃ Pre-heat time 120 sec. Max. Peak-Temperature 240℃ Max. Soldering time Condition 10 sec. Max. (2) Lead-Free Solder Lead Free Solder Pre-heat 150~200℃ Pre-heat time 120 sec. Max. Peak-Temperature 260℃ Max. Soldering ...

Page 14

Precaution for use (1) Storage In order to avoid the absorption of moisture recommended to store in a dry box (or a desiccator) with a desiccant. Otherwise, to store them in the following environment is recommended. Temperature ...

Page 15

Handling of Silicone Resin LEDs (1) During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound. (2) In general, LEDs should ...

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