TFDU6300-TR3 Vishay, TFDU6300-TR3 Datasheet - Page 7

• Manufacturer Part Number: TFDU6300-TR3
• Description: Infrared Transceivers FIR 4Mbit/s 2.4-3.6V Op Voltage
• Manufacturer: Vishay
• Type: TX/RXr

Specifications of TFDU6300-TR3

• Wavelength: 886 nm
• Continual Data Transmission: 4 Mbit/s
• Radiant Intensity: 180 mW/sr
• Half Intensity Angle Degrees: 48 deg
• Pulse Width: 2.2 us
• Maximum Rise Time: 40 ns
• Maximum Fall Time: 40 ns
• Operating Voltage: 2.4 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 25 C
• Dimensions: 8.5 mm x 3.1 mm x 2.5 mm
• Data Rate Max: 4Mbps
• Data Transmission Distance: 1m
• Peak Wavelength: 886nm
• Supply Current: 2mA
• Supply Voltage Range: 2.4V To 3.6V
• Operating Temperature Range: -25°C To +85°C
• Wavelength Typ: 886nm
• Data Rate: 4Mbps
• Angle Of Half Sensitivity: 48°
• Fall Time: 40ns
• Rise Time: 40ns
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (min): 2.4V
• Operating Supply Voltage (max): 3.6V
• Mounting: Surface Mount
• Pin Count: 8
• Operating Temp Range: -25C to 85C
• Operating Temperature Classification: Commercial
• Idle Current, Typ @ 25° C: 1.8 mA
• Link Range, Low Power: 70cm
• Operating Temperature: -25°C ~ 85°C
• Orientation: Side View
• Shutdown: *
• Size: 8.5mm x 3.1mm x 2.5mm
• Standards: IrPHY 1.4
• Supply Voltage: 2.4 V ~ 3.6 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

SETTING TO THE LOWER BANDWIDTH MODE
(2.4 kbit/s to 115.2 kbit/s)
1. Set SD input to logic “high”.
2. Set TXD input to logic “low”. Wait t
3. Set SD to logic “low” (this negative edge latches state of
4. TXD must be held for t
TXD is now enabled as normal TXD input for the high
bandwidth mode.
Note
When applying this sequence to the device already in the lower
bandwidth mode, the SD pulse is interpreted as shutdown. In this
case the RXD output of the transceiver may react with a single pulse
(going active low) for a duration less than 2 µs. The operating
software should take care for this condition.
In case the applied SD pulse is longer than 4 µs, no RXD pulse is to
be expected but the receiver startup time is to be taken into account
before the device is in receive condition.
RECOMMENDED SOLDER PROFILES
Solder Profile for Sn/Pb Soldering
Lead (Pb)-free, Recommended Solder Profile
The TFDU6300 is a lead (Pb)-free transceiver and qualified
for lead (Pb)-free processing. For lead (Pb)-free solder paste
like Sn
profiles: Ramp-Soak-Spike (RSS) and Ramp-To-Spike
(RTS). The Ramp-Soak-Spike profile was developed
primarily for reflow ovens heated by infrared radiation. With
widespread use of forced convection reflow ovens the
Document Number: 84763
Rev. 2.0, 04-Aug-09
TABLE 2 - TRUTH TABLE
TXD, which determines speed setting).
Fig. 5 - Recommended Solder Profile for Sn/Pb soldering
High
Low
SD
19535
260
240
220
200
180
160
140
120
100
(3.0 - 4.0)
80
60
40
20
0
0
Ag
2 to 4 °C/s
50
High > 150 µs
(0.5 - 0.9)
High
TXD
Low
Low
Low
100
x
Fast Infrared Transceiver Module (FIR, 4 Mbit/s)
[e-mail], [e-mail],
Cu, there are two standard reflow
h
160 °C max.
240 °C max.
120 to180 s
 200 ns.
150
Time/s
For technical questions within your region, please contact one of the following:
INPUTS
2 to 4 °C/s
OPTICAL INPUT IRRADIANCE mW/m
200
< max. detection threshold irradiance
> max. detection threshold irradiance
> min. detection threshold irradiance
for 2.4 V to 3.6 V Operation
s
 200 ns.
90 s max.
10 s max. at 230 °C
250
300
< 4
x
x
x
350
Ramp-To-Spike profile is used increasingly. Shown in
figure 4 and 5 are Vishay’s recommended profiles for use
with the TFDU6300 transceivers. For more details please
refer to the application note “SMD Assembly Instructions”.
A ramp-up rate less than 0.9 °C/s is not recommended.
Ramp-up rates faster than 1.3 °C/s could damage an optical
part because the thermal conductivity is less than compared
to a standard IC.
Wave Soldering
For TFDUxxxx and TFBSxxxx transceiver devices wave
soldering is not recommended.
Manual Soldering
Manual soldering is the standard method for lab use.
However,
recommended because the risk of damage is highly
dependent on the experience of the operator. Nevertheless,
we added a chapter to the above mentioned application note,
describing manual soldering and desoldering.
Storage
The storage and drying processes for all Vishay transceivers
(TFDUxxxx and TFBSxxx) are equivalent to MSL4.
The data for the drying procedure is given on labels on the
packing and also in the application note “Taping, Labeling,
Storage and Packing”.
SD
TXD
2
Weakly pulled (500 k) to V
[e-mail]
Fig. 4 - Mode Switching Timing Diagram
for
50 %
Low (active)
Low (echo)
a
RXD
High
High
production
x
Vishay Semiconductors
t
s
OUTPUTS
50 %
t
h
CC1
process
50 %
TFDU6300
High: FIR
TRANSMITTER
Low: SIR
it
www.vishay.com
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