PI3PCIE2612-AZFEX Pericom Semiconductor, PI3PCIE2612-AZFEX Datasheet - Page 17

• Manufacturer Part Number: PI3PCIE2612-AZFEX
• Description: IC PCI-E MUX/DEMUX 1X2 56TQFN
• Manufacturer: Pericom Semiconductor

Specifications of PI3PCIE2612-AZFEX

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Switch Test Fixture Requirements
The test fi xture for switch S-parameter measurement shall be designed and built to specifi c requirements, as
described below, to ensure good measurement quality and consistency:
• The test fi xture shall be a FR4-based PCB of the microstrip structure; the dielectric thickness or stackup
• The total thickness of the test fi xture PCB shall be 1.57 mm (0.62”).
• The measurement signals shall be launched into the switch from the top of the test fi xture, capturing the
• Traces between the DUT and measurement ports (SMA or microprobe) should be uncoupled from each
• The trace lengths between the DUT and measurement port shall be minimized. The maximum trace length
• All of the traces on the test board and add-in card must be held to a characteristic impedance of 50 Ohms
• SMA connector is recommended for ease of use. The SMA launch structure shall be designed to minimize
08-0145
shall be about 4 mils.
through-hole stub effect.
other, as much as possible. Therefore, the traces should be routed in such a way that traces will diverge
from each other exiting from the switch pin fi eld.
shall not exceed 1000 mils. The trace lengths between the DUT and measurement port shall be equal.
with a tolerance of +/- 7%.
the connection discontinuity from SMA to the trace. The impedance range of the SMA seen from a TDR
with a 60 ps rise time should be within 50+/-7 ohms.
Figure 3: Illustration of different ial near end crosstalk requirement.
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0
1
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Frequency, GHz
17
4
1:2 DP/PCIe Gen2 Display Mux, ATX Pinout
5
High Bandwidth, 6-Differential Channel
SDD21 Zref=85 Ohms
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7
8
PI3PCIE2612-A
PS8925D
07/31/08