MCIMX515CJM6CR2 Freescale Semiconductor, MCIMX515CJM6CR2 Datasheet - Page 76

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MCIMX515CJM6CR2

Manufacturer Part Number
MCIMX515CJM6CR2
Description
IC MPU I.MX51 529MABGA
Manufacturer
Freescale Semiconductor
Series
i.MX51r
Datasheets

Specifications of MCIMX515CJM6CR2

Core Processor
ARM Cortex-A8
Core Size
32-Bit
Speed
600MHz
Connectivity
1-Wire, EBI/EMI, Ethernet, I²C, IrDA, MMC, SPI, SSI, UART/USART, USB OTG
Peripherals
DMA, I²S, LCD, POR, PWM, WDT
Number Of I /o
128
Program Memory Type
ROMless
Ram Size
128K x 8
Voltage - Supply (vcc/vdd)
0.8 V ~ 1.15 V
Oscillator Type
External
Operating Temperature
-20°C ~ 85°C
Package / Case
529-LFBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-

Available stocks

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Part Number
Manufacturer
Quantity
Price
Part Number:
MCIMX515CJM6CR2
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
1
Electrical Characteristics
4.7.4
This section describes the electrical information of the Fast Ethernet Controller (FEC) module. The FEC
is designed to support both 10 and 100 Mbps Ethernet/IEEE 802.3 networks. An external transceiver
interface and transceiver function are required to complete the interface to the media. The FEC supports
the 10/100 Mbps MII (18 pins in total) and the 10 Mbps-only 7-wire interface, which uses 7 of the MII
pins, for connection to an external Ethernet transceiver. For the pin list of MII and 7-wire, refer to the
i.MX51 Multimedia Applications Processor Reference Manual (MCIMX51RM).
This section describes the AC timing specifications of the FEC.
4.7.4.1
The MII receive signal timing involves the FEC_RXD[3:0], FEC_RX_DV, FEC_RX_ER, and
FEC_RX_CLK signals. The receiver functions correctly up to a FEC_RX_CLK maximum frequency of
25 MHz + 1%. There is no minimum frequency requirement but the processor clock frequency must
exceed twice the FEC_RX_CLK frequency.
parameters and
76
1
2
3
4
5
.
Num
FEC_RX_DV, FEC_RX_CLK, and FEC_RXD0 have same timing in 10 Mbps 7-wire interface mode.
SD7
SD8
In low speed mode, card clock must be lower than 400 kHz, voltage ranges from 2.7 to 3.6 V.
In normal speed mode for SD/SDIO card, clock frequency can be any value between 0
frequency can be any value between 0
In normal speed mode for MMC card, clock frequency can be any value between 0
frequency can be any value between 0
Measurement taken with CLoad = 20 pF
To satisfy hold timing, the delay difference between clock input and cmd/data input must not exceed 2 ns.
M1
M2
M3
M4
ID
eSDHC Input Setup Time
eSDHC Input Hold Time
FEC_RXD[3:0], FEC_RX_DV, FEC_RX_ER to FEC_RX_CLK setup
FEC_RX_CLK to FEC_RXD[3:0], FEC_RX_DV, FEC_RX_ER hold
FEC_RX_CLK pulse width high
FEC_RX_CLK pulse width low
FEC AC Timing Parameters
MII Receive Signal Timing
Figure 42
i.MX51 Applications Processors for Consumer and Industrial Products, Rev. 4
Table 69. eSDHCv2 Interface Timing Specification (continued)
shows MII receive signal timings.
Parameter
Characteristic
Table 70. MII Receive Signal Timing
50 MHz.
52 MHz.
1
Table 70
lists the MII receive channel signal timing
Symbols
t
t
ISU
IH
5
35%
35%
Min
5
5
20 MHz. In high-speed mode, clock
25 MHz. In high-speed mode, clock
Min
2.5
2.5
Max
65%
65%
Freescale Semiconductor
FEC_RX_CLK period
FEC_RX_CLK period
Max
Unit
ns
ns
Unit
ns
ns

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