MCIMX257DVM4 Freescale Semiconductor, MCIMX257DVM4 Datasheet - Page 138

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MCIMX257DVM4

Manufacturer Part Number
MCIMX257DVM4
Description
IC MPU I.MX25 COMM 400MAPBGA
Manufacturer
Freescale Semiconductor
Series
i.MX25r
Datasheet

Specifications of MCIMX257DVM4

Core Processor
ARM9
Core Size
32-Bit
Speed
400MHz
Connectivity
1-Wire, CAN, EBI/EMI, Ethernet, I²C, MMC, SmartCard, SPI, SSI, UART/USART, USB OTG
Peripherals
DMA, I²S, LCD, POR, PWM, WDT
Number Of I /o
128
Program Memory Type
External Program Memory
Ram Size
144K x 8
Voltage - Supply (vcc/vdd)
1.15 V ~ 1.52 V
Data Converters
A/D 3x12b
Oscillator Type
External
Operating Temperature
-20°C ~ 70°C
Package / Case
400-LFBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MCIMX257DVM4
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
4.5
Figure 99
138
All dimensions in millimeters.Dimensioning and tolerancing per ASME Y14.5M-1994.
Maximum solder ball diameter measured parallel to datum A.
Datum A, the seating plane, is determined by the spherical crowns of the solder balls.
Parallelism measurement shall exclude any effect of mark on package’s top surface.
347 MAPBGA—Case 12 x 12 mm, 0.5 mm Pitch
shows the 12×12 mm i.MX25 production package. The following notes apply to
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 8
Figure 99. 12×12 mm i.MX25 Production Package
Freescale Semiconductor
Figure
99:

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