PK30X256VLQ100 Freescale Semiconductor, PK30X256VLQ100 Datasheet - Page 3

• Manufacturer Part Number: PK30X256VLQ100
• Description: IC ARM CORTEX MCU 256K 144-LQFP
• Manufacturer: Freescale Semiconductor
• Series: Kinetisr

Specifications of PK30X256VLQ100

• Core Processor: ARM Cortex-M4
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: CAN, EBI/EMI, I²C, IrDA, SDHC, SPI, UART/USART
• Peripherals: DMA, I²S, LCD, LVD, POR, PWM, WDT
• Number Of I /o: 102
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 64K x 8
• Voltage - Supply (vcc/vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 37x16b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 144-LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

1 Ordering parts...........................................................................4
2 Part identification......................................................................4
3 Terminology and guidelines......................................................5
4 Ratings......................................................................................9
5 General.....................................................................................11
Freescale Semiconductor, Inc.
1.1 Determining valid orderable parts......................................4
2.1 Description.........................................................................4
2.2 Format...............................................................................4
2.3 Fields.................................................................................4
2.4 Example............................................................................5
3.1 Definition: Operating requirement......................................5
3.2 Definition: Operating behavior...........................................6
3.3 Definition: Attribute............................................................6
3.4 Definition: Rating...............................................................7
3.5 Result of exceeding a rating..............................................7
3.6 Relationship between ratings and operating
3.7 Guidelines for ratings and operating requirements............8
3.8 Definition: Typical value.....................................................8
3.9 Typical value conditions....................................................9
4.1 Thermal handling ratings...................................................10
4.2 Moisture handling ratings..................................................10
4.3 ESD handling ratings.........................................................10
4.4 Voltage and current operating ratings...............................10
5.1 Nonswitching electrical specifications...............................11
5.2 Switching specifications.....................................................18
5.3 Thermal specifications.......................................................19
requirements......................................................................7
5.1.1
5.1.2
5.1.3
5.1.4
5.1.5
5.1.6
5.1.7
5.1.8
5.2.1
5.2.2
5.3.1
Voltage and current operating requirements.........11
LVD and POR operating requirements.................12
Voltage and current operating behaviors..............12
Power mode transition operating behaviors..........13
Power consumption operating behaviors..............14
EMC radiated emissions operating behaviors.......17
Designing with radiated emissions in mind...........18
Capacitance attributes..........................................18
Device clock specifications...................................18
General switching specifications...........................19
Thermal operating requirements...........................19
K30 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011.
Table of Contents
Preliminary
6 Peripheral operating requirements and behaviors....................20
7 Dimensions...............................................................................61
8 Pinout........................................................................................61
9 Revision History........................................................................70
6.1 Core modules....................................................................20
6.2 System modules................................................................24
6.3 Clock modules...................................................................24
6.4 Memories and memory interfaces.....................................29
6.5 Security and integrity modules..........................................37
6.6 Analog...............................................................................37
6.7 Timers................................................................................52
6.8 Communication interfaces.................................................52
6.9 Human-machine interfaces (HMI)......................................59
7.1 Obtaining package dimensions.........................................61
8.1 K30 Signal Multiplexing and Pin Assignments..................61
8.2 K30 Pinouts.......................................................................68
5.3.2
6.1.1
6.1.2
6.3.1
6.3.2
6.3.3
6.4.1
6.4.2
6.4.3
6.6.1
6.6.2
6.6.3
6.6.4
6.8.1
6.8.2
6.8.3
6.8.4
6.8.5
6.8.6
6.8.7
6.9.1
6.9.2
Thermal attributes.................................................20
Debug trace timing specifications.........................20
JTAG electricals....................................................21
MCG specifications...............................................24
Oscillator electrical specifications.........................27
32kHz Oscillator Electrical Characteristics............29
Flash (FTFL) electrical specifications....................30
EzPort Switching Specifications............................34
Flexbus Switching Specifications..........................35
ADC electrical specifications.................................37
CMP and 6-bit DAC electrical specifications.........45
12-bit DAC electrical characteristics.....................48
Voltage reference electrical specifications............51
CAN switching specifications................................53
DSPI switching specifications (low-speed mode)..53
DSPI switching specifications (high-speed mode) 54
I2C switching specifications..................................56
UART switching specifications..............................56
SDHC specifications.............................................56
I2S switching specifications..................................57
TSI electrical specifications...................................59
LCD electrical characteristics................................60
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