PK10X256VMD100 Freescale Semiconductor, PK10X256VMD100 Datasheet - Page 21

• Manufacturer Part Number: PK10X256VMD100
• Description: IC ARM CORTEX MCU 256K 144-MAP
• Manufacturer: Freescale Semiconductor
• Series: Kinetisr

Specifications of PK10X256VMD100

• Core Processor: ARM Cortex-M4
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: CAN, EBI/EMI, I²C, IrDA, SDHC, SPI, UART/USART
• Peripherals: DMA, I²S, LVD, POR, PWM, WDT
• Number Of I /o: 104
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 64K x 8
• Voltage - Supply (vcc/vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 37x16b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 144-LBGA
• Rohs Compliant: Yes
• Processor Series: Kinetis
• Core: ARM Cortex M4
• Data Ram Size: 64 KB
• Interface Type: UART, SPI, I2C, I2S, CAN
• Maximum Clock Frequency: 100 MHz
• Number Of Programmable I/os: 104
• Operating Supply Voltage: 1.71 V to 3.6 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

5.3.2 Thermal attributes
1.
2.
3.
4.
6 Peripheral operating requirements and behaviors
All digital I/O switching characteristics assume:
Freescale Semiconductor, Inc.
Single-layer
(1s)
Four-layer
(2s2p)
Single-layer
(1s)
Four-layer
(2s2p)
—
—
—
Board type
Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air), or EIA/JEDEC Standard JESD51-6, Integrated Circuit Thermal Test Method
Environmental Conditions—Forced Convection (Moving Air).
Determined according to JEDEC Standard JESD51-8, Integrated Circuit Thermal Test Method Environmental
Conditions—Junction-to-Board.
Determined according to Method 1012.1 of MIL-STD 883, Test Method Standard, Microcircuits, with the cold plate
temperature used for the case temperature. The value includes the thermal resistance of the interface material
between the top of the package and the cold plate.
Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air).
R
R
R
R
R
R
Ψ
Symbol
θJA
θJA
θJMA
θJMA
θJB
θJC
JT
K10 Sub-Family Data Sheet Data Sheet, Rev. 5, 5/2011.
Thermal
resistance,
junction to
ambient (natural
convection)
Thermal
resistance,
junction to
ambient (natural
convection)
Thermal
resistance,
junction to
ambient (200 ft./
min. air speed)
Thermal
resistance,
junction to
ambient (200 ft./
min. air speed)
Thermal
resistance,
junction to
board
Thermal
resistance,
junction to case
Thermal
characterization
parameter,
junction to
package top
outside center
(natural
convection)
Description
52
44
43
38
33
11
2
144 LQFP
Preliminary
50
30
41
27
17
10
2
Peripheral operating requirements and behaviors
MAPBGA
144
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
1
1
1
1
2
3
4
Notes
21