MCF51MM256CLK Freescale Semiconductor, MCF51MM256CLK Datasheet - Page 28
![IC MCU 32BIT 256K FLASH 80LQFP](/photos/39/70/397077/freescalepqfp_sml.jpg)
MCF51MM256CLK
Manufacturer Part Number
MCF51MM256CLK
Description
IC MCU 32BIT 256K FLASH 80LQFP
Manufacturer
Freescale Semiconductor
Series
MCF51MMr
Datasheet
1.TWR-MCF51MM.pdf
(58 pages)
Specifications of MCF51MM256CLK
Core Processor
Coldfire V1
Core Size
32-Bit
Speed
50MHz
Connectivity
CAN, EBI/EMI, I²C, SCI, SPI, USB OTG
Peripherals
LVD, PWM, WDT
Number Of I /o
47
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 8x16b, D/A 1x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
80-LQFP
Processor Series
MCF51MM
Core
ColdFire V1
Data Bus Width
32 bit
Mounting Style
SMD/SMT
3rd Party Development Tools
JLINK-CF-BDM26, EWCF
Development Tools By Supplier
TWR-MCF51MM-KIT, TWR-SER, TWR-ELEV, TOWER
Package
80LQFP
Device Core
ColdFire
Family Name
MCF51MM
Maximum Speed
50.33 MHz
Operating Supply Voltage
2.5|3.3 V
Number Of Programmable I/os
47
Interface Type
I2C/SCI/SPI
On-chip Adc
8-chx16-bit
On-chip Dac
1-chx12-bit
Number Of Timers
1
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MCF51MM256CLK
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Electrical Characteristics
28
Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.
10
11
12
13
#
2
3
4
5
6
7
8
9
Supply current low-power mode
Supply current high-power mode
Full-scale Settling time
(±1 LSB)
(0x080 to 0xF7F or 0xF7F to
0x080)
low-power mode
Full-scale Settling time
(±1 LSB)
(0x080 to 0xF7F or 0xF7F to
0x080)
high-power mode
Code-to-code Settling time
(±1 LSB)
(0xBF8 to 0xC08 or 0xC08 to
0xBF8)
low-power mode
Code-to-code Settling time
(±1 LSB)
(0xBF8 to 0xC08 or 0xC08 to
0xBF8)
high-power mode (3 V at Room
Temperature)
DAC output voltage range low
(high-power mode, no load, DAC
set to 0) (3 V at Room
Temperature)
DAC output voltage range high
(high-power mode, no load, DAC
set to 0x0FFF)
Integral non-linearity error
Differential non-linearity error
VDACR is > 2.4 V
Offset error
Gain error,
Characteristic
V
REFH
= V
Table 14. DAC 12-Bit Operating Behaviors (continued)
ext
= V
DD
I
I
DDA_DACHP
DDA_DACLP
Ts
Ts
Symbol
Ts
V
Ts
V
dacouth
DNL
dacoutl
C-C
C-C
INL
FS
E
E
FS
O
G
HP
LP
HP
LP
V
-100
Min
DACR
—
—
—
—
—
—
—
—
—
—
—
±0.4
±0.1
Typ
345
50
—
—
—
—
—
—
—
1
± 0.5
Max
100
500
100
200
± 8
± 1
± 3
30
—
—
5
%FSR
%FSR
LSB
LSB
Unit
mV
mV
µA
µA
µs
µs
µs
µs
Freescale Semiconductor
C
T
T
T
T
T
T
T
T
T
T
T
T
Calculated
by a best fit
curve from
V
100mV to
V
–100mV
Calculated
by a best fit
curve from
V
100mV to
V
–100mV
• V
• V
• Temperature
• V
• V
• Temperature
• V
• V
• Temperature
• V
• V
• Temperature
SS
REFH
SS
REFH
or 2.2 V
= 25°C
or 2.2 V
= 25°C
or 2.2 V
= 25°C
or 2.2 V
= 25°C
Notes
DDA
REFSEL
DDA
REFSEL
DDA
REFSEL
DDA
REFSEL
+
+
= 3 V
= 3 V
= 3 V
= 3 V
= 1
= 1
= 1
= 1