MCF51MM128VLK Freescale Semiconductor, MCF51MM128VLK Datasheet - Page 48

IC MCU 32BIT 128K COLDF 81-LQFP

MCF51MM128VLK

Manufacturer Part Number
MCF51MM128VLK
Description
IC MCU 32BIT 128K COLDF 81-LQFP
Manufacturer
Freescale Semiconductor
Series
MCF51MMr
Datasheet

Specifications of MCF51MM128VLK

Core Processor
Coldfire V1
Core Size
32-Bit
Speed
50MHz
Connectivity
CAN, EBI/EMI, I²C, SCI, SPI, USB OTG
Peripherals
LVD, PWM, WDT
Number Of I /o
47
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 8x16b, D/A 1x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 105°C
Package / Case
80-LQFP
Core
ColdFire V1
Data Bus Width
32 bit
Data Ram Size
32 KB
Interface Type
SCI, SPI, I2C, USB
Maximum Clock Frequency
50.3 MHz
Operating Supply Voltage
1.8 V to 3.6 V
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Package
80LQFP
Device Core
ColdFire
Family Name
MCF51MM
Maximum Speed
50.33 MHz
Number Of Programmable I/os
47
On-chip Adc
8-chx16-bit
On-chip Dac
1-chx12-bit
Number Of Timers
1
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MCF51MM128VLK
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
1
2
3
4
Electrical Characteristics
3.14
This section provides details about program/erase times and program-erase endurance for the Flash
memory.
Program and erase operations do not require any special power sources other than the normal V
For more detailed information about program/erase operations, see the Memory chapter in the Reference
Manual for this device (MCF51MM256RM).
48
The frequency of this clock is controlled by a software setting.
These values are hardware state machine controlled. User code does not need to count cycles. This information supplied for calculating
approximate time to program and erase.
Typical endurance for flash was evaluated for this product family on the HC9S12Dx64. For additional information on how Freescale defines
typical endurance, please refer to Engineering Bulletin EB619, Typical Endurance for Nonvolatile Memory.
Typical data retention values are based on intrinsic capability of the technology measured at high temperature and de-rated to 25C using the
Arrhenius equation. For additional information on how Freescale defines typical data retention, please refer to Engineering Bulletin EB618, Typical
Data Retention for Nonvolatile Memory.
10
#
1
2
3
4
5
6
7
8
9
Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.
Supply voltage for program/erase
–40C to 105C
Supply voltage for read operation
Internal FCLK frequency
Internal FCLK period (1/FCLK)
Byte program time (random location)
Byte program time (burst mode)
Page erase time
Mass erase time
Program/erase endurance
Data retention
T
T = 25C
L
Flash Specifications
to T
H
= –40C to + 105C
4
Characteristic
2
2
1
3
2
2
Table 24. Flash Characteristics
V
Symbol
prog/erase
V
f
t
t
t
t
t
t
FCLK
Burst
Mass
D_ret
Page
Fcyc
Read
prog
10,000
Min
150
1.8
1.8
15
5
100,000
Typical
20,000
4000
100
9
4
Max
6.67
200
3.6
3.6
Freescale Semiconductor
cycles
years
Unit
t
t
t
t
kHz
Fcyc
Fcyc
Fcyc
Fcyc
s
V
V
DD
supply.
C
D
D
D
D
C
C
P
P
P
P

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