SI5330B-A00205-GM Silicon Laboratories Inc, SI5330B-A00205-GM Datasheet - Page 13

• Manufacturer Part Number: SI5330B-A00205-GM
• Description: IC BUFFER LVDS DIFF 1:4 24QFN
• Manufacturer: Silicon Laboratories Inc
• Type: Fanout Buffer (Distribution), Translatorr

Specifications of SI5330B-A00205-GM

• Number Of Circuits: 1
• Ratio - Input:output: 1:4
• Differential - Input:output: Yes/Yes
• Input: CML, CMOS, HCSL, HSTL, LVDS, LVPECL, LVTTL, SSTL
• Output: LVDS
• Frequency - Max: 710MHz
• Voltage - Supply: 1.71 V ~ 3.63 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 24-VFQFN Exposed Pad
• Frequency-max: 710MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

Pin #
GND
PAD
20
21
22
23
24
RSVD_GND
Pin Name
VDDO0
CLK0B
CLK0A
VDD
GND
Table 9. Si5330 Pin Descriptions (Continued)
GND
VDD
VDD
I/O
O
O
Signal Type
Supply
Supply
Supply
Multi
Multi
Rev. 0.35
Output Clock Supply Voltage.
Supply voltage for CLK0A,B. Use a 0.1 µF bypass cap
as close as possible to this pin. If CLK2 is not used, this
pin must be tied to V
Si5330A/B/C/K/L/M Differential Output Devices.
This is the negative side of the differential CLK0 output.
Refer to AN408 for interfacing and termination details.
Leave unconnected when not in use.
Si5330F/G/H/J Single-ended Output Devices.
This is one of the single-ended CLK0 outputs. Both
CLK0A and CLK0B single-ended outputs are in phase.
Refer to AN408 for interfacing and termination details.
Leave unconnected when not is use.
Si5330A/B/C/K/L/M Differential Devices.
This is the positive side of the differential CLK0 output.
Refer to AN408 for interfacing and termination details.
Leave unconnected when not in use.
Si5330F/G/H/J Single-ended Devices.
This is one of the single-ended CLK0 outputs. Both
CLK0A and CLK0B single-ended outputs are in phase.
Refer to AN408 for interfacing and termination details.
Leave unconnected when not is use.
Ground.
Must be connected to system ground.
Core Supply Voltage.
The device operates from a 1.8, 2.5, or 3.3 V supply. A
0.1 µF bypass capacitor should be located very close to
this pin.
Ground Pad.
This is main ground connection for this device. It is
located at the bottom center of the package. Use as
many vias as possible to connect this pad to the main
ground plane.
DD
Description
(pin 7 and/or pin 24).
Si5330
13