CMF20120D Cree Inc, CMF20120D Datasheet

SIC MOSFET N-CH 1200V TO-247-3

CMF20120D

Manufacturer Part Number
CMF20120D
Description
SIC MOSFET N-CH 1200V TO-247-3
Manufacturer
Cree Inc
Series
SiC MOSFETr
Datasheets

Specifications of CMF20120D

Mfg Application Notes
SiC MOSFETs Application Considerations
Fet Type
SiCFET N-Channel, Silicon Carbide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
110 mOhm @ 20A, 20V
Drain To Source Voltage (vdss)
1200V (1.2kV)
Current - Continuous Drain (id) @ 25° C
33A
Vgs(th) (max) @ Id
4V @ 1mA
Gate Charge (qg) @ Vgs
90.8nC @ 20V
Input Capacitance (ciss) @ Vds
1915pF @ 800V
Power - Max
150W
Mounting Type
Through Hole
Package / Case
TO-247-3
Transistor Polarity
N Channel
Continuous Drain Current Id
33A
Drain Source Voltage Vds
1200V
On Resistance Rds(on)
0.08ohm
Rds(on) Test Voltage Vgs
20V
Configuration
Single
Resistance Drain-source Rds (on)
80 mOhms
Forward Transconductance Gfs (max / Min)
7.3 S, 6.8 S
Drain-source Breakdown Voltage
1200 V
Gate-source Breakdown Voltage
25 V
Continuous Drain Current
33 A
Power Dissipation
150 W
Mounting Style
Through Hole
Gate Charge Qg
90.8 nC
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
• Lowest switching loss in its class.
• Enables significantly higher switching frequencies with
• Reduced magnetics and filter size with significantly
world-class efficiency.
reduced cooling requirements.
1200 V 80 mΩ
• High-speed switching
• Low capacitances
• Only 20% increase in
• Easy to parallel
1.2
1.0
0.8
0.6
0.4
0.2
60
50
40
30
20
10
R
temperature range
0
0
DS(ON)
0
0
@ 25 ˚C
over operating
1
25
TFS IGBT
NPT IGBT
TFS IGBT
Si MOS 8
SiC MOS
2
Z-FET
Industry’s First SiC MOSFET
50
3
SiC Forward Characteristics vs Current Si Technology*
V
75
SiC MOS
DS
SiC Switching Characteristics vs Current Si Devices*
(V), V
T
NPT IGBT
J
(˚C)
4
CE
100
(V)
5
Lowest V
Si SJMOS
125
6
CMF20120D
f
of any device at 20 A
150
1.4
1.2
1.0
0.8
0.6
0.4
0.2
Si MOS 8
0
7
0
Normalized R
* Positive temperature coefficient for easy paralleling
175
25
8
50
2.5
2.0
1.5
1.0
0.5
60
50
40
30
20
10
DS(on)
0
75
0
0
T
0
Total
J
(°C)
Drift + JFET
vs. Temperature
100
@ 150 ˚C
* Determined by Cree to be the most appropriate Si devices
1
25
of comparable amperage rating.
NPT IGBT
Channel
TFS IGBT
Si MOS 8
SiC MOS
125
TFS IGBT
2
50
150
3
175
75
V
DS
T
(V), V
J
(˚C)
4
CE
100
NPT IGBT
(V)
μ
R
μ
R
SiC MOS
bulk
channel
drift+jfet
channel
• Reduces R
5
decreases with temp
on R
increases with temp
decreases with temp
125
increases as expected
DS(on)
Si SJMOS
6
TC
Si MOS 8
drift+jfet
150
7
TC effect
175
8

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CMF20120D Summary of contents

Page 1

... J • Lowest switching loss in its class. • Enables significantly higher switching frequencies with world-class efficiency. • Reduced magnetics and filter size with significantly reduced cooling requirements. CMF20120D ™ Normalized R vs. Temperature DS(on) 1.4 * Positive temperature coefficient for easy paralleling 1.2 Total 1 ...

Page 2

Silicon Carbide MOSFET Application Example Three Phase 400 V • 16.6 kHz SW • DC Link Voltage = 650 V • Neutral Point Clamped B6 Topology (Fraunhofer ISE, Germany) IGBT from Fairchild SiC MOSFET from ...

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