NSR05F40NXT5G ON Semiconductor, NSR05F40NXT5G Datasheet
NSR05F40NXT5G
Specifications of NSR05F40NXT5G
NSR05F40NXT5GOSTR
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NSR05F40NXT5G Summary of contents
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... Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. © Semiconductor Components Industries, LLC, 2010 September, 2010 − Rev. 3 NSR05F40NXT5G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D ...
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THERMAL CHARACTERISTICS Characteristic Thermal Resistance Junction−to−Ambient (Note 1) Total Power Dissipation @ T = 25°C A Thermal Resistance Junction−to−Ambient (Note 2) Total Power Dissipation @ T = 25°C A Storage Temperature Range Junction Temperature 1. Mounted onto ...
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V , FORWARD VOLTAGE (V) F Figure 1. Forward Voltage 120 100 TYPICAL CHARACTERISTICS 100000 10000 1000 100 10 1 −25°C 0.1 0.01 ...
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... BOTTOM VIEW See Application Note AND8398/D for more mounting details *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein ...