TBU-PL060-200-WH Bourns Inc., TBU-PL060-200-WH Datasheet - Page 5

• Manufacturer Part Number: TBU-PL060-200-WH
• Description: SURGE SUPP TBU DL 50OHM 600VIMP
• Manufacturer: Bourns Inc.
• Series: TBU™r

Specifications of TBU-PL060-200-WH

• Package / Case: SMD 6.50mm x 4.00mm
• Voltage - Working: 350V
• Voltage - Clamping: 600V
• Technology: Mixed Technology
• Number Of Circuits: 2
• Applications: SLIC
• Voltage Rating: 600 V
• Current Rating: 200 mA
• Height: 0.85 mm
• Length: 6.5 mm
• Termination Style: SMD/SMT
• Width: 4 mm
• Diode Type: Low Capacitance
• Operating Voltage: -20V
• Diode Case Style: DFN
• No. Of Pins: 8
• Peak Surge Current: 500A
• Output Current: 700µA
• Suppressor Type: Transient Voltage
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power (watts): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: TBU-PL060-200-WHTR

TBU
tion fi nish. For improved thermal dissipation, the recommended
layout uses PCB copper areas which extend beyond the exposed
solder pad. The exposed solder pads should be defi ned by a
solder mask which matches the pad layout of the TBU
size and spacing. It is recommended that they should be the same
dimension as the TBU
they should be centered on the TBU
not more than 0.10-0.12 mm (0.004-0.005 in.) smaller in overall
width or length. Solder pad areas should not be larger than the
TBU
Dark grey areas show added PCB copper area for better
thermal resistance.
Specifi cations are subject to change without notice.
Customers should verify actual device performance in their specifi c applications.
Product Dimensions
Recommended Pad Layout
®
®
TBU-PL Series - TBU
High-Speed Protectors have a 100 % matte-tin termina-
pad sizes to ensure adequate clearance is maintained. The
(.157)
4.00
(.033)
0.85
®
4
5
pads but if smaller solder pads are used,
PIN 1 & BACKSIDE CHAMFER
6
3
(.256)
6.50
(.033)
0.85
7
2
®
package terminal pads and
®
(.035)
0.90
1
8
High-Speed Protectors
(.000 - .002)
0.00 - 0.05
(.031 - .037)
0.80 - 0.95
(.033 ± .002)
®
0.85 ± 0.05
device in
DIMENSIONS:
(.053)
1.335
(.053)
1.335
(.012)
0.30
recommended stencil thickness is 0.10-0.12 mm (0.004-0.005
in.) with a stencil opening size 0.025 mm (0.0010 in.) less than the
solder pad size. Extended copper areas beyond the solder pad
signifi cantly improve the junction to ambient thermal resistance,
resulting in operation at lower junction temperatures with a
corresponding benefi t of reliability. All pads should soldered to
the PCB, including pads marked as NC or NU but no electrical
connection should be made to these pads. For minimum parasitic
capacitance, it is recommended that signal, ground or power
signals are not routed beneath any pad.
Thermal Resistance vs Additional PCB Cu Area
(INCHES)
(.045)
(.049)
1.15
1.25
MM
(.030)
0.75
120
100
0.825
(.032)
80
60
40
20
(.029)
0
0.73
(.016)
0.40
(.028)
0.70
0
(.032)
0.825
(.053)
1.35
(.030)
(.028)
0.75
0.70
0.2
(.033)
(.016)
0.85
0.40
(.047)
1.20
(.047)
0.4
1.20
(.033)
0.85
(.053)
1.35
Power in One Side of TBU
Total Power in Both Sides of TBU
0.6
Added Cu Area (Sq. In.)
(.029)
(.033)
0.725
0.85
(.030)
0.75
0.8
(.050)
1.275
(.051)
1.0
1.30
(.012)
0.30
(.050)
(.050)
1.275
1.275
1.2
C
(.033)
(.010)
0.85
0.25
1.4
®
PIN 1
Device
1.6
®
Device
1.8
2.0