B32933A3155K EPCOS Inc, B32933A3155K Datasheet - Page 10
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B32933A3155K
Manufacturer Part Number
B32933A3155K
Description
CAP FILM 1.5UF 305VAC SUPPRESS
Manufacturer
EPCOS Inc
Series
MKT B32933r
Datasheet
1.B32932A3154K.pdf
(18 pages)
Specifications of B32933A3155K
Capacitance
1.5µF
Voltage - Ac
305V
Dielectric Material
Polyester, Metallized
Tolerance
±10%
Operating Temperature
105°C Max
Mounting Type
Through Hole
Package / Case
Radial
Size / Dimension
1.043" L x 0.571" W (26.50mm x 14.50mm)
Height
1.161" (29.50mm)
Termination
PC Pins
Lead Spacing
0.886" (22.50mm)
Features
EMI Suppression
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Esr (equivalent Series Resistance)
-
Voltage - Dc
-
Other names
495-4357
1.3
Permissible heat exposure loads on film capacitors are primarily characterized by the upper cate-
gory temperature T
can lead to changes in the plastic dielectric and thus change irreversibly a capacitor's electrical
characteristics. For short exposures (as in practical soldering processes) the heat load (and thus
the possible effects on a capacitor) will also depend on other factors like:
The overheating associated with some of these factors can usually be reduced by suitable coun-
termeasures. For example, if a pre-heating step cannot be avoided, an additional or reinforced
cooling process may possibly have to be included.
EPCOS recommends the following conditions:
Uncoated capacitors
For uncoated MKT capacitors with lead spacings 10 mm (B32560/B32561) the following mea-
sures are recommended:
Please read Cautions and warnings and
Important notes at the end of this document.
Pre-heating temperature and time
Forced cooling immediately after soldering
Terminal characteristics:
diameter, length, thermal resistance, special configurations (e.g. crimping)
Height of capacitor above solder bath
Shadowing by neighboring components
Additional heating due to heat dissipation by neighboring components
Use of solder-resist coatings
Pre-heating with a maximum temperature of 110 C
Temperature inside the capacitor should not exceed the following limits:
When SMD components are used together with leaded ones, the leaded film capacitors should
not pass into the SMD adhesive curing oven. The leaded components should be assembled af-
ter the SMD curing step.
Leaded film capacitors are not suitable for reflow soldering.
pre-heating to not more than 110 C in the preheater phase
rapid cooling after soldering
MKP/MFP 110 C
MKT 160 C
General notes on soldering
B32932 ... B32936
AC applications (heavy duty series) / 305 V AC
max
. Long exposure to temperatures above this type-related temperature limit
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