SPX1117M3-L-2-5 Exar Corporation, SPX1117M3-L-2-5 Datasheet - Page 6

• Manufacturer Part Number: SPX1117M3-L-2-5
• Description: IC REG LDO 2.5V 800MA SOT223-3
• Manufacturer: Exar Corporation
• Series: -r

Specifications of SPX1117M3-L-2-5

• Package / Case: TO-261-4, TO-261AA, SOT-223-4
• Regulator Topology: Positive Fixed
• Voltage - Output: 2.5V
• Voltage - Input: Up to 15V
• Voltage - Dropout (typical): 1.1V @ 800mA
• Number Of Regulators: 1
• Current - Output: 800mA
• Current - Limit (min): 1A
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Number Of Outputs: 3
• Polarity: Positive
• Output Voltage: 5 V
• Output Type: Adjustable, Fixed
• Dropout Voltage (max): 1.3 V
• Output Current: 800 mA
• Load Regulation: 0.2 %
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

APPLICATION INFORMATION
O
To ensure the stability of the SPX1117, an
output capacitor of at least 2.2µF (tantalum or
ceramic) or 10µF (aluminum) is required. The
value may change based on the application
requirements
temperature range. The value of ESR can vary
based on the type of capacitor used in the
applications
recommended value for ESR is 0.5Ω or less. A
larger value of output capacitance (up to
100µF)
response.
© 2010 Exar Corporation
UTPUT
V
V
IN
IN
=3.3V, V
=3.3V, V
Fig. 16: Load Step Response 0mA to 800mA
Fig. 17: Load Step Response 0mA to 800mA
C
can
APACITOR
OUT
OUT
Signal 1=V
Signal 1=V
=1.8V, C
=1.8V, C
to
improve
of
guarantee
OUT
OUT
IN
IN
the
=10µF, C
=10µF, C
, Signal 4=I
, Signal 4=I
the
output
OUT
OUT
=2.2µF, Ceramic
load
=2.2µF, OSCON
stability.
LOAD
LOAD
load
transient
The
or
8
8
6/11
0
0
0
0
m
m
S
The SPX1117 SOT-223 package is designed to
be compatible with infrared reflow or vapor-
phase reflow soldering techniques. During
soldering, the non-active or mildly active
fluxes may be used. The SPX1117 die is
attached to the heatsink lead which exits
opposite the input, output, and ground pins.
Hand soldering and wave soldering should be
avoided
damage to the device with excessive thermal
gradients
recommended
follows: vapor phase reflow and infrared
reflow with the component preheated to within
65°C of the soldering temperature range.
T
The thermal resistance of SPX1117 (SOT-223
package) is 15°C/W from junction to tab and
31°C/W from tab to ambient for a total of 46
°C/W from junction to ambient (Table 1). The
SPX1117 features the internal thermal limiting
to
conditions. Special care needs to be taken
during continuous load conditions such that
the maximum junction temperature does not
exceed 125 °C. Thermal protection is activated
at >155°C and deactivated at <140 °C.
Taking the FR-4 printed circuit board and 1/16
thick
experiment
effective at transmitting heat with the tab
attached to the pad area and a ground plane
HERMAL
OLDERING
A
A
protect
L
L
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o
with
w
w
since
C
D
D
on
HARACTERISTICS
M
r
r
(fig.19),
1
o
the
o
ETHODS
p
the
p
soldering
these
ounce
o
o
u
u
device
Fig. 18
t
t
package.
V
V
the
o
o
methods
copper
l
l
t
t
a
a
method
PCB
during
g
g
e
e
The
S
S
R
R
foil
P
P
material
can
e
e
X
X
g
g
Rev. 2.0.0
SOT-223
overload
are
u
1
u
1
as
l
l
1
1
cause
a
a
1
t
1
t
o
o
an
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7
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is
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