NTLUD3A260PZTAG ON Semiconductor, NTLUD3A260PZTAG Datasheet

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NTLUD3A260PZTAG

Manufacturer Part Number
NTLUD3A260PZTAG
Description
POWER MOSFET 20V 2A 200 M UDFN6
Manufacturer
ON Semiconductor
Datasheet

Specifications of NTLUD3A260PZTAG

Fet Type
2 P-Channel (Dual)
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
200 mOhm @ 2A, 4.5V
Drain To Source Voltage (vdss)
20V
Current - Continuous Drain (id) @ 25° C
1.7A
Vgs(th) (max) @ Id
1V @ 250µA
Gate Charge (qg) @ Vgs
4.2nC @ 4.5V
Input Capacitance (ciss) @ Vds
300pF @ 10V
Power - Max
800mW
Mounting Type
Surface Mount
Package / Case
6-UFDFN Exposed Pad
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
NTLUD3A260PZTAG
Manufacturer:
ON Semiconductor
Quantity:
2 350
Part Number:
NTLUD3A260PZTAG
Manufacturer:
ON/安森美
Quantity:
20 000
NTLUD3A260PZ
Power MOSFET
−20 V, −2.1 A, mCoolt Dual P−Channel,
ESD, 1.6x1.6x0.55 mm UDFN Package
Features
Applications
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.127 in sq
2. Surface-mounted on FR4 board using the minimum recommended pad size
© Semiconductor Components Industries, LLC, 2010
September, 2010 − Rev. 1
MAXIMUM RATINGS
Drain-to-Source Voltage
Gate-to-Source Voltage
Continuous Drain
Current (Note 1)
Power Dissipa-
tion (Note 1)
Continuous Drain
Current (Note 2)
Power Dissipation (Note 2)
Pulsed Drain Current
Operating Junction and Storage
Temperature
Source Current (Body Diode) (Note 2)
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
Conduction
Compliant
Products, such as Cell Phones, PMP, DSC, GPS, and others
UDFN Package with Exposed Drain Pads for Excellent Thermal
Low Profile UDFN 1.6x1.6x0.55 mm for Board Space Saving
ESD Protected
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
High Side Load Switch
PA Switch
Optimized for Power Management Applications for Portable
[2 oz] including traces).
of 30 mm
2
, 2 oz. Cu.
Parameter
Steady
Steady
Steady
t ≤ 5 s
t ≤ 5 s
State
State
State
(T
J
= 25°C unless otherwise stated)
T
T
T
T
T
T
T
T
tp = 10 ms
A
A
A
A
A
A
A
A
= 25°C
= 85°C
= 25°C
= 25°C
= 25°C
= 25°C
= 85°C
= 25°C
Symbol
V
T
V
I
P
P
T
STG
T
DSS
DM
I
I
I
GS
D
D
S
J
D
D
L
,
Value
-55 to
±8.0
−1.7
−1.2
−2.1
−1.3
−0.9
−8.0
−0.6
−20
150
260
0.8
1.3
0.5
1
Units
°C
°C
W
W
V
V
A
A
A
A
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
G1
V
(BR)DSS
−20 V
1
(Note: Microdot may be in either location)
ORDERING INFORMATION
6
AD = Specific Device Code
M = Date Code
G = Pb−Free Package
D1
http://onsemi.com
P−Channel MOSFET
200 mW @ −4.5 V
290 mW @ −2.5 V
390 mW @ −1.8 V
650 mW @ −1.5 V
CASE 517AT
R
S1
mCOOLt
MOSFET
(Top View)
DS(on)
UDFN6
Publication Order Number:
G2
MAX
NTLUD3A260PZ/D
1
MARKING
DIAGRAM
AD MG
D2
I
D
−2.1 A
G
MAX
S2

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NTLUD3A260PZTAG Summary of contents

Page 1

NTLUD3A260PZ Power MOSFET −20 V, −2.1 A, mCoolt Dual P−Channel, ESD, 1.6x1.6x0.55 mm UDFN Package Features • UDFN Package with Exposed Drain Pads for Excellent Thermal Conduction • Low Profile UDFN 1.6x1.6x0.55 mm for Board Space Saving • ESD Protected ...

Page 2

THERMAL RESISTANCE RATINGS Junction-to-Ambient – Steady State (Note 3) Junction-to-Ambient – t ≤ (Note 3) Junction-to-Ambient – Steady State min Pad (Note 4) ELECTRICAL CHARACTERISTICS (T Parameter OFF CHARACTERISTICS Drain-to-Source Breakdown Voltage Drain-to-Source Breakdown Voltage Temperature Coefficient Zero ...

Page 3

25° −4 −V , DRAIN−TO−SOURCE VOLTAGE (V) DS Figure 1. On−Region Characteristics 0.80 0.70 0.60 0.50 0.40 ...

Page 4

C iss 300 200 100 C oss C rss −V , DRAIN−TO−SOURCE VOLTAGE (V) DS Figure 7. Capacitance Variation 1000 V = −4 − ...

Page 5

... DEVICE ORDERING INFORMATION Device NTLUD3A260PZTAG NTLUD3A260PZTBG †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. TYPICAL CHARACTERISTICS ≤ − 25° LIMIT ...

Page 6

... NOTE 3 0.05 C 0.50 PITCH *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81− ...

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