DM240313 Microchip Technology, DM240313 Datasheet - Page 26

• Manufacturer Part Number: DM240313
• Description: BOARD DEMO 8BIT XLP
• Manufacturer: Microchip Technology
• Series: XLP™r
• Type: MCUr

Specifications of DM240313

• Contents: Board
• Data Bus Width: 8 bit
• Silicon Manufacturer: Microchip
• Core Architecture: PIC
• Core Sub-architecture: PIC16, PIC18
• Silicon Core Number: PIC16F, PIC18F
• Kit Contents: Board
• Features: 32 Character Backlit LCD Display, Temperature Sensor
• Rohs Compliant: Yes
• Silicon Family Name: PIC18FxxKxx
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With/related Products: *
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

XLP 8-Bit Development Board User’s Guide
DS41581A-page 26
3.2.7
The board features seven green LEDs [D8 – D1] (RA5, RB5, RB4, RE7, RE6, RE5 and
RE4) that can serve as user-defined outputs. The LEDs are not used in the demonstra-
tion software and, by default, jumper J27 is unpopulated, preventing the LEDs use.
3.2.8
A 100 kΩ potentiometer (R9) is connected to AN3 for both MCU devices. It can be
adjusted from V
The potentiometer functions to show the full capable range of the temperature display.
Its functionality is dependent upon J19 and J20 configuration.
3.2.9
The board includes the NHD‐C0216CZ‐FSW‐FBW‐3V3 from Newhaven Display Inter-
national. The screen features the ability to write 2 lines x 16 characters, runs at 3 V
with a 3V backlight display supported by two side White LEDs used for backlight.
3.2.10
A 24AA256 256 KB (32 Kbytes x 8) serial EEPROM (U1) is connected to SPI for both
the PIC16(L)F1947 64-pin and PIC18F87K22 80-pin devices. It is used to demonstrate
SPI bus operation. It is included for nonvolatile firmware storage, in addition to the inter-
nal data EEPROM of the PIC16 and PIC18 devices.
3.2.11
The XLP 8-bit board implements a 28-pin modular expansion interface (J21).
This modular expansion is in place to allow use with some PICtail™ interface available
on many Microchip demo and development boards. It may not implement the full range
of signals supported by some PICtail interfaces; the connector pin assignments for J21
are shown in
users reference the schematic before using a PICtail™ expansion on the board. This
additional modular expansion allows the user to incorporate other Microchip demo
boards or all expansion of peripheral features through use of the expansion interface.
3.2.12
The XLP 8-bit board supports the expansion and use of a serial connection. The SAP
supports the outputs of (TX, V
Through the use of SW4 and J4/J5 the user has the ability to output a signal which can
be recognized through UART, SAP, or I
upon the SAP PROTOCOL switch (S1).
3.2.13
The MCP9700 Low-Power Linear Active Thermistor IC supports a range of -40°C to
+125°C and operates between the range of 2.3V and 5.5V, consuming typically 6 uA
current when active. The temperature sensor’s output is read by the MCU through pin
RA3 if jumper J20 is set to pins [2-3].
3.2.14
To assist in the development and testing of application hardware, the XLP board
includes a 24 x 11 prototype area for the installation of the user’s custom circuitry.
Sources for the board power V
from 19 different I/O signals, the prototyping area supplies a wide range of possible fea-
tures which can be tested and experimented with from the prototyping area.
User-Defined LEDs
Potentiometer
16x2 Character LCD with Controller and Backlight
Serial EEPROM
Modular Expansion Connector
Serial Accessory Port
Temperature Sensor
Generous Prototyping Area
Appendix 1. “Development Board
DD
to V
SS
to provide an analog input voltage to the A/D Converter.
DD
DD
, GND, SDA, SCL, RX) from the SAP header (J2).
and ground are located above the area. Supplied
2
C™. The type of communication is dependent
Schematics”. It is recommended
 2011 Microchip Technology Inc.
DD