PIC16F1828-I/ML Microchip Technology, PIC16F1828-I/ML Datasheet - Page 365
![IC PIC MCU 8BIT 14KB FLASH 20QFN](/photos/19/6/190620/4696160_sml.jpg)
PIC16F1828-I/ML
Manufacturer Part Number
PIC16F1828-I/ML
Description
IC PIC MCU 8BIT 14KB FLASH 20QFN
Manufacturer
Microchip Technology
Series
PIC® XLP™ 16Fr
Datasheets
1.PIC16F722-ISS.pdf
(8 pages)
2.PIC16F1826-IP.pdf
(40 pages)
3.PIC16F1824-ISL.pdf
(2 pages)
4.PIC16F1824-ISL.pdf
(419 pages)
5.PIC16F1824-ISL.pdf
(10 pages)
Specifications of PIC16F1828-I/ML
Core Size
8-Bit
Program Memory Size
7KB (4K x 14)
Core Processor
PIC
Speed
32MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
17
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 5.5 V
Data Converters
A/D 12x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
20-VFQFN Exposed Pad
Controller Family/series
PIC16F
No. Of I/o's
18
Eeprom Memory Size
256Byte
Ram Memory Size
256Byte
Cpu Speed
32MHz
No. Of Timers
5
Processor Series
PIC16F
Core
PIC
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F1828-I/ML
Manufacturer:
MICROCHIP
Quantity:
631
Part Number:
PIC16F1828-I/ML
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
- PIC16F722-ISS PDF datasheet
- PIC16F1826-IP PDF datasheet #2
- PIC16F1824-ISL PDF datasheet #3
- PIC16F1824-ISL PDF datasheet #4
- PIC16F1824-ISL PDF datasheet #5
- Current page: 365 of 419
- Download datasheet (4Mb)
PIC16(L)F1824/1828
30.6
DS41419B-page 364
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C T
TH01
TH02
TH03
TH04
TH05
TH06
TH07
Legend:
Note 1: I
Param
No.
2: T
3: T
Thermal Considerations
P
DD
INTERNAL
A
J
T
Sym.
P
TBD = To Be Determined
P
= Junction Temperature
JMAX
= Ambient Temperature
PD
DER
is current to run the chip alone without driving any load on the output pins.
JA
JC
I
/
O
Thermal Resistance Junction to Ambient
Thermal Resistance Junction to Case
Maximum Junction Temperature
Power Dissipation
Internal Power Dissipation
I/O Power Dissipation
Derated Power
A
Characteristic
+125°C
Preliminary
Typ.
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
150
—
—
—
—
Units
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C
W
W
W
W
8-pin PDIP package
8-pin DFN 3X3mm package
14-pin PDIP package
14-pin SOIC package
14-pin TSSOP 4x4mm package
16-pin QFN 4X4mm package
8-pin PDIP package
8-pin DFN 3X3mm package
14-pin PDIP package
14-pin SOIC package
14-pin TSSOP 4x4mm package
16-pin QFN 4X4mm package
PD = P
P
8-pin SOIC package
8-pin SOIC package
P
P
INTERNAL
I
DER
/
O
= (I
= PD
INTERNAL
2010 Microchip Technology Inc.
OL
= I
MAX
* V
DD
Conditions
(T
OL
+ P
x V
J
) + (I
- T
DD
I
/
O
A
(1)
)/
OH
JA
(2)
* (V
DD
- V
OH
))
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