832HT-375ML MG Chemicals, 832HT-375ML Datasheet
832HT-375ML
Manufacturer Part Number
832HT-375ML
Description
POTTING COMPOUND HIGHTEMP 375ML
Manufacturer
MG Chemicals
Series
832r
Type
Potting Compound, 2 Partr
Datasheets
1.422A-P.pdf
(52 pages)
2.422A-P.pdf
(2 pages)
3.832HT-375ML.pdf
(2 pages)
4.832HT-375ML.pdf
(6 pages)
Specifications of 832HT-375ML
Features
High Temperature
Product
Epoxy Compounds
Chemical Component
Epoxy Resin Type Bis-F/Phenol Novolac Type Epoxy Resin
Primary Type
Adhesive
Weight
12 Oz.
For Use With/related Products
Sealing Electronic Components
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
473-1085
Encapsulating and Potting Epoxy Compound > RoHS Compliant
High Temperature Epoxy Encapsulating and Potting
Compound
For encapsulating and potting electronics in high temperature environments, aggressive
chemical environments, or where improved technology protection is desired. Bonds to a
wide variety of substrates, including metals, glass, ceramics and many plastics.
Features / Benefits
Typical Applications
Specifications
Cured Properties - Physical
Part A
Part B
Mixed
Mixing Ratio by Volume
Mixing Ratio by Mass
Maximum Service Temperature
Color
Maximum Intermittent Temperature
Working Time (100 gram sample)
Hardness, Shore D
Tensile Strength
Elongation
Compressive Strength
Flexural Strength
Flexural Modulus
Lap Shear Strength
Coefficient of Thermal Expansion
Deflection Temperature Under Load
Thermal Conductivity
Thermal Conductivity @ 25 ºC (77ºF)
Thermal Diffusivity @ 25 ºC (77 ºF)
832HT
-40 ºC to 50 ºC
+100 ºC to +250 ºC
-40 ºC to +250 ºC
+25 ºC to + 250 ºC
Viscosity
Viscosity
Viscosity
Extreme physical strength and chemical resistance
Suitable for extreme environments, such as submersion in salt water, acids,
bases, fuels, and alcohols
Protects against strong vibrations, abrasions, and direct physical impact
Extremely difficult to remove - grants incredible technology protection
Maximum service temperature of 275°C (527°F)
Use in electronic assemblies to prevent vibration damage
Encapsulate circuits for the purpose of technological protection
at 20 ºC (68 ºF)
at 20 ºC (68 ºF)
at 20 ºC (68 ºF)
Test Method
ASTM-D-638-02a
ASTM-D-638-02a
ASTM-D-695-02a
ASTM-D-790-03
ASTM-D-790-03
ASTM-D-1002-01
ASTM-D-648-01
ASTM-D-648-01
ASTM-E-1530-99
ASTM-E-1461-92
ASTM-E-1461-92
Result
54,800 cps
11,000 cps
40,000 cps
2.0 : 1.0
(Part A: Part B)
2.186 : 1.000
(Part A: Part B)
275 ºC (527 ºF)
Black
300 ºC (572 ºF)
1 hour
80
7,861 PSI
3.38%
11,870 PSI
14,600 PSI
399,000 PSI
1,794 PSI
75.7x10
154.0x10
125.3x10
140.2x10
53.9 ºC (129.02 ºF)
0.210 W/mºK
0.218 W /mºK
-6
-6
-6
-6
mm/mmºC
mm/mmºC
mm/mmºC
mm/mmºC
Page 1 of 2
11/8/2010
832HT-375ML Summary of contents
Page 1
... Encapsulating and Potting Epoxy Compound > RoHS Compliant High Temperature Epoxy Encapsulating and Potting Compound 832HT For encapsulating and potting electronics in high temperature environments, aggressive chemical environments, or where improved technology protection is desired. Bonds to a wide variety of substrates, including metals, glass, ceramics and many plastics. ...
Page 2
... Cured Properties - Electrical Corrected Dissipation Factor, D Dielectric Constant Dissipation Factor Volume Resistivity Surface Resistivity Dielectric Strength Breakdown Voltage Sample Size (grams) 50 100 500 Available Sizes Catalog Number 832HT-375ML 832HT-3L - ASTM-E-1269-01 1419 J/kgºK 24 hours 60 minutes 45 minutes 35 minutes 25 minutes 15 minutes ...