25136NAB APEM Components, 25136NAB Datasheet - Page 7

• Manufacturer Part Number: 25136NAB
• Description: SWITCH MINI SLIDE
• Manufacturer: APEM Components
• Series: 25000Nr

Specifications of 25136NAB

• Orientation: Vertical
• Circuit: SPDT
• Switch Function: On-On
• Contact Rating @ Voltage: 4A @ 125VAC
• Actuator Type: Flush
• Mounting Type: Through Hole
• Termination Style: PC Pin
• Contact Configuration: SPDT
• Actuator Style: Vertical Flush
• Switch Operation: ON-NONE-ON
• Contact Voltage Ac Max: 250V
• Contact Voltage Dc Max: 30V
• Contact Current Max: 4A
• Contact Form: SPDT
• Contact Rating: 1 Amp at 30 Volts
• Mounting Style: Through Hole
• Travel: 4 mm
• Switch Mounting: PCB
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 25136NAB; 679-1886

APEM
P.C. BOARD REWORK RECOMMENDATIONS
Hot air reflow technique is preferred. Avoid the
use of a soldering iron.
Caution: Excessive and/or repeated high temp-
erature exposure may affect switch performance
& reliability.
The printed circuit board, carried by a conveyor belt,travels through the reflow
soldering oven and experiences the following programmed cycles:
C
240
240
200
200
100
100
0
0
, PO BOX 8288, HAVERHILL, MA USA 01835-0788 TOLL FREE: [phone] FAX: [phone] E-mail: [e-mail]
a. pre-heat to a maximum of 200°C for 30 seconds
b. reflow at a maximum of 245°C for 10 seconds
c. final cleaning
pre-heating
pre-heating
TG SERIES - SMT WASHABLE TINY SLIDE SWITCHES
150 C
150 C
TEMPERATURE/TIME PROFILE (typical)
60
60
drying
drying
stabilization
stabilization
60 s
60 s
REFLOW SOLDERING - STANDARD PROFILE
120
120
170 C
170 C
reflow
reflow
peak
peak
240 C
240 C
180
180
gradual cooling
gradual cooling
240
240
t (s)
t (s)
Solder paste
application
Component
placement
Reflow
soldering
Final
cleaning
P.C. board
PROCESSING STEPS
E7
E