14-6040-0031 Kester Solder, 14-6040-0031 Datasheet - Page 17

• Manufacturer Part Number: 14-6040-0031
• Description: SOLDER SOLID WIRE 21AWG 60/40
• Manufacturer: Kester Solder
• Type: Solder, Solid Wire (No Flux)r

Specifications of 14-6040-0031

• Composition: Sn60Pb40 (60/40)
• Melting Point: 361 ~ 374°F (183 ~ 190°C)
• Wire Gauge: 21 AWG
• Diameter: 0.031" (0.79mm)
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Other names: KE1604

Pounds (avdp.)
Pounds (avdp.)
Pounds (avdp.)
Ounces (avdp.)
Quarts (liquid)
Gallons (US)
Celsius = 5/9 (F-32)
To Change
WEIGHTS AND MEASURES
COMMON CONVERSIONS
EXAMPLE 1: When soldering Beryllium Copper to Tin, you could use any of the products listed in Category 2, 3, or 4 since Beryllium Copper
EXAMPLE 2: If you were soldering Solder coated leads to a Copper surface, you could use any of Kester's products (Category 1, 2, 3, or 4).
Category
STANDARD SOLDER PASTE REFLOW PROFILE
ALLOYS: Sn96.5Ag3.0Cu0.5 or Sn96.5Ag3.5
1
2
3
4
Ounce (troy)
Kilograms
requires more active products than Tin.
Grams
Grams
Liters
Liters
To
FOR KESTER PASTE CONTAINING
Fahrenheit = 9/5 (C) + 32
Immersion Tin, Immersion Silver
Inconel, Monel, Stainless Steel
Beryllium Copper, Palladium,
Platinum, Gold, Copper, Tin,
Zinc, Mild Steel, Chromium,
If trying to solder to this
Nickel, Cadmium, Brass,
Lead, Bronze, Rhodium,
Nickel-Iron, Kovar
metal surface:
Solder, Silver
Multiply By:
Technical Data
453.592
14.5833
28.3495
3.7853
0.9463
0.4536
EniviroMark™ 907, EnviroMark™ 828
HydroMark 531, TSF 6592LV,
All products can solder these
Easy Profile
Base metal must be plated.
Base metal must be plated.
Tacky Soldering Fluxes
Metal Solderability Chart
Solder Paste and
TSF 6800 Series
metal surfaces.
Tin can be added to solder to replace tin lost by oxidation. The pot temperature should be
at least 460°F. Tin bars should be added slowly and the solder should be mixed well.
®
256 & 256HA
Table 1
Please visit www.kester.com and click on Lead-Free Solutions™
T = Pounds of Tin to add
A = Percentage of Tin desired
T =
for a worksheet to balance Lead-Free alloy systems.
W(A - B)
(100 - A)
FORMULA FOR ADDING TIN TO
TIN-LEAD SOLDER POTS
Call Kester's Customer Service
All products can solder these
900 (63 - 61.6)
2331-ZX, 2235, 2224-25,
(100 - 63)
Flux-Pen
186, 1544, 2120,
Liquid Fluxes and
metal surfaces.
2222, 2220-VF
2222, 2220-VF
Department
®
Formulas
B = Percentage of Tin in pot
W = Pounds of solder on pot
EXAMPLE
=
Stage 1- Preheat Zone
(Rapid Heating Stage)
The purpose of this zone is to quickly bring the
assembly up to a temperature where solder paste
can become highly chemically active.
Stage 2- Soak Zone
(Temperature Equalization Stage)
The purpose of this stage is for the thermal mass of
the assembly to reach a uniform temperature
plateau so that there is a very small differential
between the hottest and coldest soldering locations
on the assembly.
Stage 3- Reflow Zone
(Rapid Heating and Cooling)
The purpose of this stage is to rapidly heat the
assembly above the melting (liquidus) temperature
of the solder and subsequently cool the assembly
down quickly to solidify the solder. Wetting of solder
onto substrates occurs in the reflow zone.
1260
37
=
34 lbs. of
Tin to add
All products can solder these
44, 48, 331, OR-421
48, 331, OR-421
metal surfaces.
Cored Wire
48