24-6337-6403 Kester Solder, 24-6337-6403 Datasheet - Page 15

SOLDER WATER SOLUABLE 21AWG 1LB

24-6337-6403

Manufacturer Part Number
24-6337-6403
Description
SOLDER WATER SOLUABLE 21AWG 1LB
Manufacturer
Kester Solder
Series
331r
Type
Solder, Organic Water Solubler
Datasheets
1.53-0000-0041.pdf (18 pages)
2.24-6337-6403.pdf (2 pages)

Specifications of 24-6337-6403

Composition
Sn63Pb37 (63/37)
Melting Point
361°F (183°C)
Wire Gauge
21 Gauge - 3.3% Flux
Diameter
0.031" (0.79mm)
Alloy
Sn63Pb37
Diameter, Outer
0.031 in.
Weight
1 lbs.
Outer Diameter
0.031"
Solder Gauge Awg
21AWG
Solder Alloy
63/37 Sn/Pb
External Diameter
0.031"
Flux Percent
3%
Leaded Process Compatible
No
Rohs Compliant
No
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
For Use With
Flux-Cored Solder Wire
Other names
KE1300
TSF-6592LV Lead-Free No-Clean
(For Screen Printing/Stencil Printing/Pin Transfer)
TSF-6592LV is compatible with lead and lead-free solder alloys such as SnAg,
SnCu, SnAgCu, SnAgBi, and can be reflowed in nitrogen or air with peak
temperatures up to 270ºC. The residues are clear, non-conductive, and
non-corrosive.
for a wide range of temperature and humid conditions.
TSF-6502 No-Clean
(Lower Viscosity for Screen
Printing/Thin Film Deposition)
TSF-6502 is a no-clean tacky soldering flux formula designed for
BGA/CSP/PGA screen printing, sphere/pin processing or for repair and
reballing/repinning. It possesses a high activity level, allowing it to solder
nickel surfaces. The robust wetting action of the TSF-6502 will allow OSP
treated copper, as well as heavily oxidized copper, surfaces to exhibit good
soldering properties, even after 2 or 3 thermal cycles. TSF-6502 is designed
Kester Tacky Soldering Fluxes
Kester's TSFs are the industry standard for attachment of spheres to BGA and µBGA packages. The TSFs are also used in electronics assembly opera-
tions to solder flip chip components to PWB substrates. Kester's TSF portfolio includes a complete line of no clean and water-soluble products capable
of being screen and stencil printed, dot dispensed, or thin film transfer processed.
Kester Part #
Kester Part #
300303
300304
300305
300103
300104
300105
TSF-6592LV No-Clean
TSF-6592LV No-Clean
TSF-6592LV No-Clean
TSF-6502 No-Clean
TSF-6502 No-Clean
TSF-6502 No-Clean
Description
Description
Tacky Soldering Fluxes
150g cartridge
150g cartridge
Packaging
30g syringe
30g syringe
Packaging
100g jar
100g jar
TSF-6852 Lead-Free Water Soluble
(For Screen or Stencil Printing)
TSF-6850 is an aggressive synthetic flux with residues that are easily and
completely cleaned with water temperatures ranging from 20-65ºC yielding
bright, shiny joints. TSF-6852 is a drop-in solution for solder alloys that will
have a liquidus up to 300ºC. TSF-6852 also has a 6 month shelf life when
stored between 0-25ºC (refrigerated or room temperature).
Kester Part #
300203
300204
300206
TSF-6852 Water-Soluble
TSF-6852 Water-Soluble
TSF-6852 Water-Soluble
Description
165g cartridge
Packaging
30g syringe
100g jar