BGA-CSP-UG OKI METCAL, BGA-CSP-UG Datasheet

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BGA-CSP-UG

Manufacturer Part Number
BGA-CSP-UG
Description
KIT UPGRADE BGA-3500 TO CSP-3500
Manufacturer
OKI METCAL
Series
3500r
Datasheet
1.BGA-SPAT-L.pdf (6 pages)

Specifications of BGA-CSP-UG

Accessory Type
Conversion Kit
For Use With/related Products
CSP Rework Systems
Other names
BGACSPUG
Phone: + 1-650-325-3291 1-800-776-1778
an OK International Company
Worldwide and U.S. Headquarters
D-65428 Russelsheim-Konigstadten
No. 22 Chao Yang Men Wai Avenue
Beijing Prime Tower, Room 1901
Phone: + 33 (0)4 72 08 75 75
Menlo Park, CA 94025 USA
Eagle Close, Chandler’s Ford
Hsin-Tai-Wu Road, Hsi-Chih
Phone: + 866-2-2698-4013
Rue Ampere - ZI Lyon Nord
Beijing, P. R. China 100020
Phone: + 44 23 8048 9100
Fax: + 33(0)4 72 08 75 70
Phone: + 49 (6142) 93600
Phone: + 86 10 6588 3360
Strada Statale 11 -No. 28,
Fax: + 49 (6142) 936050
20010 Vittuone (Milano)
Phone: + 39 02 9025161
Fax: + 866-2-2698-4021
Fax: + 44 23 8048 9109
Fax: + 86 10 6588 3359
Fax: + 1-650-325-5932
Europe Headquarters
Fax: + 39 02 90111147
Taipei Hsien, TAIWAN
Bensheimer StraBe 61
Eastleigh Hampshire
Asia Headquarters
1530 O’Brien Drive
Chao Yang District,
5F No. 79 Sec. 1
SO53 4NF U.K.
69730 Genay
Germany
France
China
Italy
Precision Systems for the Electronics Bench
Phone: + (61) (2) 9832 8052
Phone: + 82 (2) 2643 8833
Fax: + (61) (2) 9832 8045
Phone: + 81-3-3449-7451
Fax: + 82 (2) 2643-5539
Minchinbury NSW 2770
Fax: + 81-3-3440-2010
330-11 Sinjeong-Dong
www.metcal.com
Unit 1, 8 Grex Avenue
Yangcheon-ku, Seoul
Yangcheon B/D 5F,
Tokyo 1 50-001 3
(representative)
(representative)
2F ASK Bldg.
1-24-4 Ebisu
Shibuya-Ku
Australia
Korea
Japan
© 2000 Metcal Inc.
BG A
BGA & CSP Rework Systems.
The comprehensive solution to array package rework.
CSP
Precision Systems for the Electronics Bench

BGA-CSP-UG Summary of contents

Page 1

... Chao Yang District, Beijing China 100020 Phone 6588 3360 Fax 6588 3359 an OK International Company Japan Shibuya-Ku Korea Australia © 2000 Metcal Inc CSP BGA & CSP Rework Systems. The comprehensive solution to array package rework. Precision Systems for the Electronics Bench ...

Page 2

... CSPs are generally smaller than BGAs and have a typical ball pitch of between 0.5 and 1mm. These parts are increasingly common on products where space premium and the ultimate volumes are expected to far exceed that of BGA. CSPs offer new challenges in terms of accurate placement and material deposition during rework. Flip Chip A bare silicon die that has solder bumps attached and is assembled face down onto a substrate ...

Page 3

... Using micrometer adjustment, the images can be accurately aligned in the X, Y & Theta axis, prior to placement. The BGA 3590 incorporates a corner overlay mechanism to facilitate alignment on large components, while the CSP 3500 offers higher magnification and greater clarity for smaller components with reduced ball pitches ...

Page 4

... QFP-SPAT QFP Spatula assortment 21149 Co-Planar stencil adapter Dip Transfer Plates Metcal dip transfer plate sets are available for QFP, BGA and CSP applications as listed below. All kits are supplied with a metal squeegee blade. DIP TRANSFER PLATES PART NUMBER DESCRIPTION DTP-BGA Set of 3 plates, apertures 28, 35 & ...

Page 5

... Set of board holding clamps (5 small & 5 large) BGA-BH-30 Upgrade kit for board holder (Includes rails and clamps) CSP-VAC Vacuum needle accessory kit for CSP pick up BGA-CSP-UG Conversion kit to CSP configuration (Optics & Vacuum) SPARE-101 Level 1 spares kit for BGA/CSP 3501/3591 100/115v SPARE-102 ...

Page 6

... BGA/CSP 115V & 230V SYSTEMS SPECIFICATIONS BGA-3590 SERIES Input voltage 230v Models 230v AC, 50/60Hz Input voltage 115v Models 115v AC, 50/60Hz Power consumption Base unit 1400W Control box 420W max Reflow head heater element All voltages: 28v AC 280W max ...