DTP-CSP OKI METCAL, DTP-CSP Datasheet - Page 7

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DTP-CSP

Manufacturer Part Number
DTP-CSP
Description
KIT DIP TRANSFER CSP 3-PLATES
Manufacturer
OKI METCAL
Datasheets

Specifications of DTP-CSP

Accessory Type
DIP Transfer Plates
For Use With/related Products
-
Other names
DTPCSP
APR-5000-XLS Array Package Rework System
The APR-5000-XLS Array Package Rework System provides large board capability with small board
precision. This system performs precise, cost effective rework of the widest range of PCBs and component
types, from large boards up to 24.5" x 24.5" (622mm x 622mm) to components down to 0.020" x 0.010"
(0.50mm x 0.25mm).
The flexible APR-5000-XLS System incorporates dual stage pre-heaters and has the thermal capacity and
control to execute precise profiles of both large and small PCBs, delivering uniform temperature control
horizontally, across the surface of PCBs up to 0.25" (6.35mm) thick, and vertically between the die and ball of
the reworked component.
Motorized X, Y, Z adjustments speed placement and help ensure process repeatability. In
addition, motorized Theta axis provides 360° rotation to simplify component
orientation. Together, these advanced controls reduce operator fatigue, improve
placement accuracy and provide process consistency.
Featured on the APR-5000-XLS Array Package Rework System is an innovative
Split Vision System, which allows operators to view the opposite corners of a
component, including splitting on rectangular components, with the necessary
magnification to make its placement and registration fast and accurate.
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